FlexTwin SuperServer SYS-222FT-HEA-LCC, 2U 4-Node FlexTwin¿ with 2 hot-swap E1.S drives per node
Starting atContact Sales
Key Applications: Oil & Gas ; Scientific Research ; High Performance Computing (HPC) ; Research Lab ; Key Features : Four hot-pluggable Liquid cooling systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Intel® Xeon® 6900 Series Processors with P-cores up to 500W with liquid cooling ; 2. Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM ; 3. Flexible networking with up to 1 OCP 3.0 compatible AIOM slots ; 4. Optional 1 PCIe 5.0 x16 FHHL slot + Default 1 PCIe 5.0 x16 LP slot ; 5. Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots ; 6. 4x Redundant Up to 3200W Titanium Level Power Supplies ;
Hyper SuperServer SYS-222H-TN, 2U with 8 hot-swap 2.5" NVMe/SAS/SATA bays and 4 PCIe 5.0 & 16x AIOM
Starting atContact Sales
Key Applications: Virtualization ; Software-defined Storage ; 5G Core and Edge ; AI Inference and Machine Learning ; Cloud Computing ; Enterprise Server ; Key Features : 1.Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores ; 2. 32x DIMM slots supporting up to 8TB of memory ; 3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards ; 4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible) ; 5. 8x 2.5" hot-swap NVMe/SATA/SAS drive bays with optional configurations for 16x/24x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card ;
Hyper SuperServer SYS-222HA-TN, 2U with 8 hot-swap 2.5" NVMe/SAS/SATA bays and 4 PCIe 5.0 x16 slots
Starting atContact Sales
Key Applications: Artificial Intelligence (AI) ; Virtualization ; High Performance Computing ; Data Analytics ; Key Features : 1. Dual Intel® Xeon® 6900-Series Processors with P-cores up to 500W ; 2. Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 6TB 8800MT/s DDR5 MRDIMM ; 3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards ; 4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible) ; 5. 8x 2.5" hot-swap NVMe/SATA/SAS drive bays with optional configurations for 16x/24x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card ;
IoT SuperServer SYS-222HE-FTN, X14 DP 2U short-depth front I/O system with 6 hot-swap 2.5" NVMe/SAS
Starting atContact Sales
Key Applications: Virtualization ; Software-defined Storage ; 5G Core and Edge ; AI Inference and Machine Learning ; Cloud Computing ; Enterprise Server ; Key Features : 1.Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores ; 2. 32x DIMM slots supporting up to 8TB of memory ; 3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 (6FHFL + 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL + 1 FHHL) slots with support for double-width GPU/Accelerator cards ; 4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible) ; 5. 6x Rear hot-swap 2.5" NVMe/SAS/SATA drive bays with optional configurations for additional 2 or 4 front hot-swap 2.5" NVMe drive bays (space share with PCIe slots); 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card ;
IoT SuperServer SYS-222HE-TN, X14 DP 2U short-depth rear I/O system with 6 hot-swap 2.5" NVMe/SAS
Starting atContact Sales
Key Applications: Virtualization ; Software-defined Storage ; 5G Core and Edge ; AI Inference and Machine Learning ; Cloud Computing ; Enterprise Server ; Key Features : 1.Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores ; 2. 32x DIMM slots supporting up to 8TB of memory ; 3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 (6FHFL + 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL + 1 FHHL) slots with support for double-width GPU/Accelerator cards ; 4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible) ; 5. 6x Front hot-swap 2.5" NVMe/SAS/SATA drive bays with optional configurations for additional 2 or 4 Rear hot-swap 2.5" NVMe drive bays (space share with PCIe slots); 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card ;
MP SuperServer SYS-242H-NR, 2U 4-socket system with 64 DIMMs and 8 NVMe drive bays
Starting atContact Sales
Key Applications: Business Intelligence ; ERP, CRM ; Scientific Virtualization ; In-Memory Database ; HCI ; SAP HANA ; Key Features : 1.Quad Intel® Xeon® 6700-Series Processors with P-cores up to 350W with air cooling ; 2. Support for up to 2 double-width PCIe GPU accelerator cards ; 3. Up to 64x DIMMs supporting up to 16TB DDR5 in 2DPC ; 4. Flexible networking with up to 2 OCP 3.0 compatible AIOM slots ; 5. Up to 2 PCIe 5.0 x8 FHHL + 4 PCIe 5.0 x16 FHHL + 2 PCIe 5.0 x16 AIOM ; 6. Up to 8 front hot-swap 2.5" NVMe drive bays ; 7. 4x Redundant 2700W Titanium Level power supplies ;
SMC SSG-521E-E1CR24H, Single Socket LGA-4677, 4th/5th Gen Intel Xeon, DDR5 RDIMM 16x slots, IPMI, 2U
Starting atContact Sales
Key Applications - Virtualization - HPC, Data Center - Corporate Database - High End Enterprise Server - iSCSI SAN - Database Processing & Storage - Appliance Optimized Storage Building Blocks Key Features 1. Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processor. Up to 300W TDP. 2. 16 ECC DDR5-5600: LRDIMM/RDIMM 3. Two Dedicated PCIe 5.0 x16 AIOM slots (OCP 3.0 SFF compliant). Up to 6x PCIe 5.0 Slots (Slot #2 populated by 3908 controller by default) 4. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node
SMC SSG-521E-E1CR24L, Single Socket LGA-4677, 4th/5th Gen Intel Xeon, DDR5 RDIMM 16x slots, IPMI, 2U
Starting atContact Sales
Key Applications - Virtualization - HPC, Data Center - Corporate Database - High End Enterprise Server - iSCSI SAN - Database Processing & Storage - Appliance Optimized Storage Building Blocks Key Features 1. Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processor. Up to 300W TDP. 2. 16 ECC DDR5-5600: LRDIMM/RDIMM 3. Two Dedicated PCIe 5.0 x16 AIOM slots (OCP 3.0 SFF compliant). Up to 6x PCIe 5.0 Slots (Slot #2 populated by 3908 controller by default) 4. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN per node
SMC SYS-222BT-DNR, 2x Nodes, Dual Socket E2 LGA-4710,1xAIOM,12xHS 2.5" SATA3/NVMe,M.2,IPMI,2U/R2200W
Starting atContact Sales
Key Applications High-Performance File System Diskless HPC Clusters Scale Out All-Flash NVMe Storage Big Data Analytics and AI Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 330W with air or liquid cooling - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot Up to 2 PCIe 5.0 x8 LP + 1 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1 - Up to 12 front hot-swap 2.5" PCIe 5.0 NVMe drive bays
SMC SYS-222BT-HNC,4xNodes,Dual Socket E2 (LGA-4710),AIOM,6xHS 2.5" SAS/NVMe,M.2,IPMI,2U
Starting atContact Sales
Key Applications Container-as-a-Service; Application Accelerator Diskless HPC Clusters All-Flash Hyperconverged Infrastructure Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling Single CPU configurations supported while maintaining all expansion slot functionality - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot Up to 2 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 feature via SCC-A2NM2241GH-B1 - Up to 6 front hot-swap 2.5" NVMe/SAS drive bays Built-in SAS3 Support via Broadcom 3808; IT Mode
SMC SYS-222BT-HNC9R,4xNodes,Dual Socket E2 (LGA-4710),6xHS 2.5" SAS/NVMe,M.2,IPMI,2U
Starting atContact Sales
Key Applications - Mission Critical HPC - Virtualized Big Data Analytics - High-Density Storage RAID Array Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot - 1 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1 - Up to 6 front hot-swap 2.5" NVMe/SAS drive bays Built-in SAS3 Support and RAID Options via Broadcom 3908; IR Mode
SMC SYS-622BT-DNC,2xNodes,2xLGA-4710,AIOM,6x HS 3.5" SAS3(3808/IT)/NVMe,IPMI,D5(4TB),2U/R2200W
Starting atContact Sales
Key Applications: - Hyperconverged Infrastructure - Scale-Out Object Storage - Back-up & Recovery Key Features: Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following- - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 250W with air cooling or 330W with liquid cooling - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot - Up to 2 PCIe 5.0 x8 LP + 1 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1 - Up to 6 front hot-swap 3.5" NVMe/SAS drive bays
SMC SYS-622BT-HNC,4xNode,2xLGA-4710,Video,AIOM,3xHS 3.5" SAS3(3808/IT)/NVMe,M.2,IPMI,D5(4TB),2U/R3KW
Starting atContact Sales
Key Applications: - Hyperconverged Infrastructure - Scale-Out File Storage - Container Storage Key Features: Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 processors with E-cores up to 165W with air cooling or 330W with liquid cooling. Single CPU configurations supported while maintaining all expansion slot functionality - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot - Up to 2 PCIe 5.0 x16 LP slots; Tool-less support Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1 - Up to 3 front hot-swap 3.5" NVMe/SAS drive bays Built-in SAS3 Support via Broadcom 3808; IT Mode
Super 1013S-MTR, 1x AMD 7000, 1xPCIe+M.2, Video, 2x GB/210, 4xHS SATA3 Bays,IPMI,D4(1TB),1U RM,R400W
Starting atContact Sales
Key Features ¿ Web Hosting, VM ¿ Cloud Computing ¿ Connectivity/Storage    Computer Nodes 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 1TB Registered ECC DDR4   2666MHz SDRAM in 8 DIMMs 3. Expansion slots:    1 PCI-E 3.0 x16 (FH/HL) slot    M.2 Interface: PCI-E 3.0 x4     (NVMe based)    M.2 Form Factor: 2280, 22110    M.2 Key: Onboard M-key    Number of M.2: Single 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 1GbE LAN ports via Intel® I210 6. 4 hot-swap 3.5" SATA3 drive bays   or 4 SAS3 ports (SAS Add-on Card   is optional),   1 M.2 NVMe SSD Supported 7. 400W Redundant Platinum Level   Power Supplies   (Full redundancy based on configuration   and application load)
Super 1114CS-TNR,1xAMD 7003,2xPCIe 4,VGA,LAN via 2xAIOM,10x HS 2.5" HS Bays,IPMI,D4(4TB),1U RM,R860W
Starting atContact Sales
Key Applications - Financial Services - Cloud Computing - Network Appliance - Private Cloud - Content Delivery Network (CDN) - Deep Learning Inferencing Key Features 1. Single AMD EPYC¿ 7002/7003 Series Processor 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. Expansion slots: 2 PCI-E 4.0 x16 (FHHL) slots, 2 AIOM slots for flexible networking  (One x8 AIOM slot and one x16 AIOM slot) 4. Integrated IPMI 2.0 + KVM with dedicated LAN ¿ Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5. 10 Hot-swap 2.5" SATA3 drive bays, optional 10x SAS3/NVMe support via additional SAS/NVMe kit M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 6. 2 USB 3.0 ports (rear), 1 VGA, 1 COM, ASPEED AST2600 BMC graphics 7. Tool-less Drive Trays and Tool-less Brackets 8. 860W Redundant Platinum Level Power Supplies (Full redundancy based on configuration and application load)
Super 2013S-C0R,1xAMD7000,6xPCIe+M.2,Video,2xGB/210,8xHS SAS3(3008/IR mode),IPMI,D4(1TB),2U RM,R740W
Starting atContact Sales
Key Features ¿ Cloud and Virtualization needs ¿ Connectivity/Storage    Computer Nodes ¿ Database Processing & Storage ¿ High End Enterprise Server ¿ Hosting & Application delivery 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 1TB Registered ECC DDR4   2666MHz SDRAM in 8 DIMMs 3. Expansion slots:    3 PCI-E 3.0 x16 (low profile);    3 PCI-E 3.0 x8 (low profile)    M.2 Interface: PCI-E 3.0 x4     (NVMe based)    M.2 Form Factor: 2280, 22110    M.2 Key: Onboard M-key    Number of M.2: Single 4. IPMI 2.0 + KVM with dedicated LAN 5. 2x 1GbE LAN ports via Intel® I210 6. 8 hot-swap 3.5" SAS3/SATA3 Drive Bays   (on-board Broadcom 3008 IR mode),   1 M.2 NVMe SSD slot Supported 7. 740W Redundant Platinum Level   high-efficiency Power Supplies   (Full redundancy based on configuration   and application load)
Super 2014CS-TR, 1xAMD 7003,4xPCIe 4.0,VGA,LAN via 2xAIOM,12x HS SATA3 Bays,IPMI,D4(4TB),2U RM,R920W
Starting atContact Sales
Key Applications - Financial Services - Cloud Computing - Network Appliance - Private Cloud - Content Delivery Network (CDN) - Deep Learning Inferencing Key Features 1. Single AMD EPYC¿ 7002/7003 Series Processor 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. Expansion slots: 4 PCI-E 4.0 x16 (FH, 10.5" L) slots,  or 2 PCI-E 4.0 x16 (FHHL) + 4 PCI-E 4.0 x8   (FHHL) slots; 2 AIOM slots for flexible networking  (One x8 AIOM slot and one x16 AIOM slot) 4. Integrated IPMI 2.0 + KVM with dedicated LAN ¿ Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5. 12 Hot-swap 3.5" SATA3/SAS3/NVMe drive bays:  12 SATA3 by default  or 8 SATA3 + 4NVMe via optional cables  or 12 SAS3 via optional SAS kit; Optional 2x 2.5" peripheral drive bays via  rear drive bay kits M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 6. 2 USB 3.0 ports (rear), 1 VGA, 1 COM, ASPEED AST2600 BMC graphics 7. Tool-less Drive Trays and Tool-less Brackets 8. 920W Redundant Platinum Level Power Supplies (Full redundancy based on configuration and application load)
Super 2014S-TR, 1xAMD 7003,7xPCIe 4.0,VGA,2x GB LAN,12x HS SATA3 Bays,2xM.2,IPMI,D4(2TB),2U RM,R920W
Starting atContact Sales
Key Applications - Backup storage - Web or Database Servers - Compact Network Appliance Key Features 1. Single AMD EPYC¿ 7002/7003 Series Processor 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 5 PCI-E 4.0 x16 LP slots, 2 PCI-E 4.0 x8 LP slots 4. 2x 1GbE LAN ports, 1 dedicated IPMI LAN port 5. 12 Hot-swap 3.5" SATA3 drive bays, 2 rear Hot-swap 2.5" SATA3 Drive bays  via optional kit M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 6. 6 USB 3.0 ports (4 rear, 2 via header), 1 VGA, 1 COM, ASPEED AST2500 BMC graphics 7. 920W Redundant Platinum Level Power Supplies (Full redundancy based on configuration and application load)
Super 2015A-TR,1xAMD Ryzen 7000 ,Video,2xGB,8xHS 3.5"/2.5" SAS/SATA,2xM.2,IPMI,D5(128GB),2U RM,R800W
Starting atContact Sales
Main Navigation (Enterprise) Products Solutions Company Support Buy Breadcrumb » Products » Systems » Mainstream Datasheet Share IconShare Key Applications Designed for financial companies AMD Xilinx Solarflare X2 and X3 Ethernet adapters validated Key Features AMD Ryzen¿ 7000 Series LGA1718 up to 170W TDP Processors 4x DDR5 UDIMM Slots, ECC/Non-ECC DDR5-5200 Up to total 128GB 2x PCIe 5.0 x16 (FHHL) slots (16/NA or 8/8) 2x 1GbE LAN (Intel® I210-AT) IPMI 2.0 + KVM with Dedicated LAN (1GbE) 800W High-Efficiency Power Supply Titanium Level Certified
Super 2015CS-TNR,1xEPYC/9004,Video,2xAIOM LAN,12xHS 3.5"/2.5" NVMe/SAS/SATA,IPMI,D4(3TB),2U RM,R860W
Starting atContact Sales
Key Features Single 4th Generation AMD EPYC¿ 9004 Series Processors 12 DIMM slots up to 3TB 3DS ECC RDIMM DDR5-4800MHz 2 PCI-E 5.0 x16 FHFL 2 PCI-E 5.0 x16 FHHL Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 12x 3.5/2.5" hot-swap hybrid NVMe/SATA/SAS drive bays