Product Overview

Key Applications Container-as-a-Service; Application Accelerator Diskless HPC Clusters All-Flash Hyperconverged Infrastructure Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling Single CPU configurations supported while maintaining all expansion slot functionality - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot Up to 2 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 feature via SCC-A2NM2241GH-B1 - Up to 6 front hot-swap 2.5" NVMe/SAS drive bays Built-in SAS3 Support via Broadcom 3808; IT Mode