Product Overview

Key Applications : HPC ; Deep Learning/AI/Machine Learning Development ; Scale-Out Object Storage ; Cloud Gaming ; ; MEC (Multi-Access Edge Computing) ; Multi-Purpose CDN ; Telco Edge Cloud ; IoT Edge Computing / Gateway ; Cluster Node ; GPU Virtualization (VDI) ; HPC cluster computer nodes ; Key Features : Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with P-cores up to 500W with air cooling ; 2. Up to 12x DIMMs supporting up to 3TB MRDIMM 8800 in 1DPC ; 3. Flexible networking with up to 2 PCIe 5.0 x16 FH AOC + 1 optional AIOM slot ; 4. Up to 2 PCIe 5.0 x16 FH10.5"L slots (1x double-width GPU or 2x single-width AOCs) ; 5. GrandTwin front IO module offers additional value for networking expansion(10G/25G/200G) ; 6. 2x Redundant 2200W Titanium (certification pending) Level power supplies ;