Product Overview

Key Features - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. IPMI 2.0 + KVM with dedicated LAN 5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays; 2 M.2 SATA3 or NVMe support 6. SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60 7. Video via Aspeed AST2500 BMC 8. 4 Heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level (96%)

Specifications

Product SKUs
SYS-2029BT-HNC1R
Motherboard
Super X11DPT-B
Processor/Cache (per Node)
CPU: Dual Socket P (LGA 3647), Intel® Xeon® Scalable Processors,Dual UPI up to 10.4GT/s, Support CPU TDP 70-205W, Cores: Up to 28 Cores with Intel® HT Technology
System Memory (per Node)
Memory Capacity: 24 DIMM slots, Up to 3TB ECC 3DS LRDIMM, 3TB ECC RDIMM, DDR4 up to 2666MHz, Memory Type: 2666/2400/2133MHz ECC DDR4 SDRAM
Chipset
Intel® C621 chipset, SAS: SAS3 (12Gbps) via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60, Network: Must bundle with at least one SIOM network card, IPMI: Support for Intelligent Platform Management Interface v.2.0, IPMI 2.0 with virtual media over LAN
Chassis
Form Factor: 2U Rackmount, Model:CSE-217BHQ+-R2K22BP2
Dimensions and Weight
Width:17.6" (447mm), Height:3.47" (88mm), Depth: 28.75" (730mm), Package:24.65" (H) x 9.76" (W) x 45.28" (D), Weight: Gross Weight: 85 lbs (38.6kg), Net Weight: 54.5 lbs (24.7 kg)
Power Supply
2200W Redundant Power Supplies with PMBus