Super F628R3-RTB+, 4xNodes, 2xE5-2600v4, Video, 2x GB, 6+2x HS SATA3(C612)+R, IPMI,D4(2TB),4U/R1280W
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Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s 2. Up to 1TB ECC DDR4 2133MHz; 16x DIMM sockets 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x8 (Micro Low Profile) See Cable Configuration Map 4. I/O ports: 2 GbE ports, 1 Built-in video, 1 COM/Serial port, 2 USB 3.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 6+2 3.5" Hot-swap SATA3 HDD Bays 7. 2x 80mm 11k RPM middle fans 8. 1280W Redundant Power Supplies Platinum Level (95%)
Super F628R3-RTBN+, 4x Nodes,2xE5-2600v4, Video, 2x GB, 6+2x HS SATA3/NVMe+R, IPMI,D4(2TB),4U/R1280W
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Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s 2. Up to 1TB ECC DDR4 2133MHz; 16x DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x8 (Micro Low Profile) See Cable Configuration Map 4. I/O ports: 2 GbE ports, 1 video, 1 COM/Serial port, 2 USB 3.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 8x 3.5" Hot-swap SATA3 or 6x 3.5" Hot-swap SATA3 + 2x SATA/NVMe hybrid 7. NVMe Support 8. 2x 80mm 11k RPM middle fans 9. 1280W Redundant Power Supplies Platinum Level (95%)
Super F628R3-RTBPT+, 4x Nodes,2xE5-2600v4,Video,2x 10GB,6+2x HS SATA3(C612)+R,IPMI,D4(2TB),4U/R1280W
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Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s 2. Up to 1TB ECC DDR4 2133MHz; 16x DIMM sockets 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x8 (Micro Low Profile) See Cable Configuration Map 4. I/O ports: 2 10GBase-T, 1 Built-in video, 1 COM/Serial port, 2 USB 3.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 6+2 3.5" Hot-swap SATA3 HDD Bays 7. 2x 80mm 11k RPM middle fans 8. 1280W Redundant Power Supplies Platinum Level (95%)
Super F628R3-RTBPTN+, 4x Nodes,2xE5-2600v4,Video,2x 10GB,6+2x HS SATA3/NVMe+R,IPMI,D4(2TB),4U/R1280W
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Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3 family; QPI up to 9.6GT/s 2. Up to 1TB ECC DDR4 2133MHz; 16x DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x8 (Micro Low Profile) See Cable Configuration Map 4. I/O ports: 2 10GBase-T, 1 video, 1 COM/Serial port, 2 USB 3.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 8x 3.5" Hot-swap SATA3 or 6x 3.5" Hot-swap SATA3 + 2x SATA/NVMe hybrid 7. 2x Internal NVMe ports (4x PCI-E 3.0) 8. 2x 80mm 11k RPM middle fans 9. 1280W Redundant Power Supplies Platinum Level (95%)
Super F629P3-RC0B,4x Nodes,2x LGA3647,Video,1xSIOM,8x HS SAS3/S3008/IT Mode,IPMI,D4(1.5TB),4U/R1200W
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Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots Supports Intel Optane Memory NVDIMM 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM) 4. SIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2 7. SAS3 via Broadcom 3008 8. 2x 8cm 14k RPM middle fans 9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)
Super F629P3-RC1B,4x Nodes,2x LGA3647,Video,1xSIOM,8x HS SAS3/S3108/HW Raid,IPMI,D4(1.5TB),4U/R1200W
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Integrated Board Super X11DPFR-SN Views: | Angled (node) | Top (node) | | Angled Front (system) | Rear (system) | Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots Supports Intel Optane Memory NVDIMM 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM) 4. SIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 8 Hot-swap 3.5" SAS3/SATA3 or 6 Hot-swap 3.5" SAS3/SATA3 + 2 optional NVMe U.2 7. SAS3 via Broadcom 3108, HW RAID 8. 2x 8cm 14k RPM middle fans 9. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)
Super F629P3-RTB, 4x Nodes, 2x LGA3647, Video, 1x SIOM, 8x HS SATA3(C621), IPMI, D4(1.5TB),4U/R1200W
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Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots Supports Intel Optane Memory NVDIMM 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM) 4. SIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 8 Hot-swap 3.5" SATA3 drive bays 7. 2x 8cm 14k RPM middle fans 8. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)
Super F629P3-RTBN,4x Nodes,2x LGA3647,Video,1x SIOM,6x HS SATA3+2x NVMe U.2,IPMI,D4(1.5TB),4U/R1200W
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Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots Supports Intel Optane Memory NVDIMM 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM) 4. SIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 8 Hot-swap 3.5" SATA3 or 6 Hot-swap 3.5" SATA3 + 2 NVMe U.2 7. 2x 8cm 14k RPM middle fans 8. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)
Super F647G2-F73+, 2x Nodes, 2x X9/12C,6x GPUs,Video,2x GB NIC,8x 2.5" HS SAS2,IPMI,D3(1TB),4U,R200W
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family¿ 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM sockets 3. 6x PCI-E 3.0 x16 for Double-width GPU/Xeon Phi; 2x PCI-E 3.0 x8 slots 4. Front I/O ports: Dual GbE LAN, 2x USB 2.0, and 1x VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 8x 2.5" Hot-swap SAS/SATA HDDs; SAS2 support via LSI 2308 7. 2000W Redundant Power Supplies Platinum Level (94%+)
Super F647G2-F73PT+,2x Nodes,2x X9/12C,6x GPUs,Video,2x10G NIC,8x 2.5" HS SAS2,IPMI,D3(1TB),4U,R200W
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family¿ 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM sockets 3. 6x PCI-E 3.0 x16 for Double-width GPU/Xeon Phi; 2x PCI-E 3.0 x8 slots 4. Front I/O ports: Dual 10GBase-T, 2x USB 2.0, and 1x VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 8x 2.5" Hot-swap SAS/SATA HDDs; SAS2 support via LSI 2308 7. 2000W Redundant Power Supplies Platinum Level (94%+)
Super F647G2-FT+,2x Nodes,2x X9/12C,6x GPUs,Video,2x GB NIC,8x 2.5" HS SATA,IPMI,D3(1TB),4U,R200W
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family¿ 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM sockets 3. 6x PCI-E 3.0 x16 for Double-width GPU/Xeon Phi; 2x PCI-E 3.0 x8 slots 4. Front I/O ports: Dual GbE LAN, 2x USB 2.0, and 1x VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 6x 2.5" Hot-swap SATA HDDs Bays 7. 2000W Redundant Power Supplies Platinum Level (94%+)
Super F647G2-FTPT+,2x Nodes,2x X9/12C,6x GPUs,Video,2x10G NIC,8x 2.5" HS SATA,IPMI,D3(1TB),4U,R200W
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R (LGA 2011) supports Intel® Xeon® processor E5-2600 and E5-2600 v2 family¿ 2. Up to 1TB ECC DDR3, up to 1866MHz; 16x DIMM sockets 3. 6x PCI-E 3.0 x16 for Double-width GPU/Xeon Phi; 2x PCI-E 3.0 x8 slots 4. Front I/O ports: Dual 10GBase-T, 2x USB 2.0, and 1x VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 6x 2.5" Hot-swap SATA HDD Bays 7. 2000W Redundant Power Supplies Platinum Level (94%+)
Super F648G2-FC0+,2x Node,F I/O,6xGPU,2xE5-2600v4,Video,2x GB,8x HS 2.5" SAS3/LSI3008,D4(2T),4U/R2KW
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4¿/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB¿ ECC 3DS LRDIMM , up to DDR4- 2400¿MHz ; 16x DIMM slots 3. 6 PCI-E 3.0 x16 Double-width GPU/Xeon Phi; 2 PCI-E 3.0 x8 (Full-height, Half-length) slots 4. Front I/O ports: 2 GbE, 2 USB 3.0 and 1 VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) w/ dedicated LAN port 6. 8x 2.5" Hot-swap SAS3 drives via LSI 3008 controller 7. 2000W High efficiency (96%) Redundant PSU; Titanium Level
Super F648G2-FC0PT+,2xNode,FI/O,6xGPU,2xE5-2600v4,Video,2x10GB,8xHS 2.5" SAS3/LSI3008,D4(2T),4U/R2KW
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4¿/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB¿ ECC 3DS LRDIMM , up to DDR4- 2400¿MHz ; 16x DIMM slots 3. 6 PCI-E 3.0 x16 Double-width GPU/Xeon Phi; 2 PCI-E 3.0 x8 (Full-height, Half-length) slots 4. Front I/O ports: 2 10GBase-T, 2 USB 3.0 and 1 VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) w/ dedicated LAN port 6. 8x 2.5" Hot-swap SAS3 drives via LSI 3008 controller 7. 2000W High efficiency (96%) Redundant PSU; Titanium Level
Super F648G2-FT+, 2x Node,F I/O,6x GPU,2x E5-2600v4,Video,2x GB/i350,8x HS 2.5" SATA3,D4(2T),4U/R2KW
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4¿/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB¿ ECC 3DS LRDIMM , up to DDR4- 2400¿MHz ; 16x DIMM slots 3. 6 PCI-E 3.0 x16 Double-width GPU/Xeon Phi; 2 PCI-E 3.0 x8 (Full-height, Half-length) slots 4. Front I/O ports: 2 GbE, 2 USB 3.0 and 1 VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) w/ dedicated LAN port 6. 8x 2.5" Hot-swap SATA3 drive bays 7. 2000W High efficiency (96%) Redundant PSU; Titanium Level
Super F648G2-FTPT+,2x Node,F I/O,6x GPU,2xE5-2600v4,Video,2x10GB/X540,8xHS 2.5" SATA3,D4(2T),4U/R2KW
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Key Features 2 Hot-plug System Nodes in 4U Front I/O. 6x GPU/Xeon Phi per node. Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4¿/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB¿ ECC 3DS LRDIMM , up to DDR4- 2400¿MHz ; 16x DIMM slots 3. 6 PCI-E 3.0 x16 Double-width GPU/Xeon Phi; 2 PCI-E 3.0 x8 (Full-height, Half-length) slots 4. Front I/O ports: 2 10GBase-T, 2 USB 3.0 and 1 VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) w/ dedicated LAN port 6. 8x 2.5" Hot-swap SATA3 drive bays 7. 2000W High efficiency (96%) Redundant PSU; Titanium Level
Super FatTwin(4xNode) 3rdGen Scalable+3.5" Server
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High-Density Multi-Node Server: FatTwin® is Supermicro's high-density 4U multi-node system, supporting a variety of processor and storage configurations, plus AIOM and riser card networking options. FatTwin's capabilities are enhanced even more with 3rd Gen Intel® Scalable processors and PCIe Gen4. Highlights: *Highly configurable 4U 8, 4, and 2 node systems, *Front accessible service design for cold-aisle serviceability, *Hot-swappable drive bays ¿ interchangeable NVMe, SAS or SATA. Innovations: *Shared Power Architecture for Best Efficiency, *Redundant cooling and power configurations for high availability, * Optimized Designs for Storage and Compute Density. Optimized for: *Hyperscale / Hyperconverge, Cloud Optimized Servers, Data Center Enterprise Applications, Scale out of Storage expansion, Telcom Data Center & ETSI certified, Virtualization Server. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs and 4 DIMMs).
Super FatTwin(4xNode) AMD 7003+3.5" Server
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High-Density Multi-Node Server: FatTwin® is Supermicro's high-density 4U multi-node system, supporting a variety of processor and storage configurations, plus AIOM and riser card networking options. FatTwin's capabilities are enhanced even more with Single AMD EPYC 7003/7002 Series Processor and PCIe Gen4. Highlights: *Highly configurable 4U/8 node systems, *Front accessible service design for cold-aisle serviceability, *Hot-swappable drive bays-interchangeable NVMe, SAS or SATA. Innovations: *Shared Power Architecture for Best Efficiency, *Redundant cooling and power configurations for high availability, * Optimized Designs for Storage and Compute Density. Optimized for: *Hyperscale / Hyperconverge, Cloud Optimized Servers, Data Center Enterprise Applications, Scale out of Storage expansion, Telcom Data Center & ETSI certified, Virtualization Server. Complete System Only: To maintain quality and integrity, this product is sold only as a completely assembled system (for optimal performance 8 DIMMs is recommended). Minimum requirement is 1 CPU, 4 DIMMs, 1 HDD/NVMe and 1 AIOM/AOC NIC card per node.
Super FatTwin(4xNodes)+3.5 Scalable Server
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The new generation X11 Supermicro FatTwin is a high-density 8/4 hot-plug node SuperServer® system available with a variety of memory capacities, HDD technologies, M.2 SSD NVMe, PCIe alternatives, and networking capabilities. The FatTwin¿ supports up to: 1.5TB ECC RDIMM DDR4-2666MHz memory in 12 DIMM slots, 1 PCI-E 3.0 x16 and 1 SIOM flexible nework card 8 ports of Broadcom SAS 3.0 (12Gbps) HBA or HW RAID, 10 ports of SATA 3.0 (6Gbps) with Intel® C621 controller, redundant Titanium Level (96%) Digital power supplies, integrated IPMI 2.0 with KVM over dedicated LAN, and dual Intel® Xeon® Scalable processor families up to 26 cores and165W TDP. The Supermicro FatTwin represents a revolution in Green Computing and is highly efficient by design; this system supports customers' critical applications while reducing Data Center TCO in order to help preserve the environment, and extends the compute and storage capabilities of Supermicro's existing Twin SuperServer® systems to achieve increased performance and power efficiency. Due to its shared components, the FatTwin¿ improves cost-effectiveness and reliability, while its modular architecture makes it flexible to configure and easy to maintain. Versatile configurations allow the FatTwin to be optimized for many different environments including Enterprise, Data Center, Cloud Computing, HPC, Financial, Science and Engineering, File and Storage Servers.
Super FatTwin(8xNode) 3rdGen Scalable+2.5" Server
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High-Density Multi-Node Server: FatTwin® is Supermicro's high-density 4U multi-node system, supporting a variety of processor and storage configurations, plus AIOM and riser card networking options. FatTwin's capabilities are enhanced even more with 3rd Gen Intel® Scalable processors and PCIe Gen4. Highlights: *Highly configurable 4U 8, 4, and 2 node systems, *Front accessible service design for cold-aisle serviceability, *Hot-swappable drive bays ¿ interchangeable NVMe, SAS or SATA. Innovations: *Shared Power Architecture for Best Efficiency, *Redundant cooling and power configurations for high availability, * Optimized Designs for Storage and Compute Density. Optimized for: *Hyperscale / Hyperconverge, Cloud Optimized Servers, Data Center Enterprise Applications, Scale out of Storage expansion, Telcom Data Center & ETSI certified, Virtualization Server. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs and 4 DIMMs).