Super AMD EPYC 9004 GPU+2.5" 4U Server
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Supermicro Best GPU Servers for Modern Data Centers. The Most Comprehensive AI Systems Featuring the Latest Multi-GPU and Interconnect Technologies. 4U GPU Lines: Maximum Acceleration and Flexibility for AI/Deep Learning and HPC Applications. *GPU: NVIDIA HGX A100 8-GPU with NVLink, or up to 10 double-width PCIe GPUs, *CPU: AMD EPYC 9004, *Memory: Up to 32 DIMMs, 8TB DRAM or 12TB DRAM + PMem, *Drives: Up to 24 Hot-swap 2.5" SATA/SAS/NVMe.
Super AMD EPYC 9004 GPU+2.5" 8U Server
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Supermicro Best GPU Servers for Modern Data Centers. The Most Comprehensive AI Systems Featuring the Latest Multi-GPU and Interconnect Technologies. 8U GPU Lines: Maximum Acceleration and Flexibility for AI/Deep Learning and HPC Applications. *GPU: NVIDIA HGX A100 8-GPU with NVLink, or up to 10 double-width PCIe GPUs, *CPU: AMD EPYC 9004, *Memory: Up to 24 DIMMs, 8TB DRAM or 12TB DRAM + PMem, *Drives: Up to 14 Hot-swap 2.5" SATA/SAS/NVMe.
Super ARS-111GL-NHR,nVidia GH200/C2C,VGA,2xPCIe5.0, 8x HS E1.S NVMe Bays,2xM.2,LPDDR5X(480G),1U R2KW
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Key Applications High Performance Computing AI/Deep Learning Training and Inference Large Language Model (LLM) and Generative AI Key Features High density 1U GPU system with Integrated NVIDIA® H100 GPU NVIDIA Grace Hopper¿ Superchip (Grace CPU and H100 GPU) NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
Super ARS-211GL-NR,2x nVidia Grace,VGA,7xPCIe5x16,AOC via LAN,8xHS E1.S NVMe Bays,DR5X(480G),2U R2KW
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Key Applications High Performance Computing AI/Deep Learning Training Large Language Model (LLM) Natural Language Processing General purpose CPU workloads, including analytics, data science, simulation, HPC, application servers, and more Key Features High density 2U GPU system with up to 4 NVIDIA® H100 PCIe GPUs Highest GPU communication using NVIDIA® NVLINK¿ PCIe-based H100 NVL with NVLink Support Energy-Efficient NVIDIA Grace¿ CPU Superchip with 144 Cores. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum on Grace Superchip Module, Min of 240GB Memory, 2 GPUs, 1 Storage device, and 1 NIC or either Cx7 or Bluefielw 3). Service: OSNBD3 is hightly recommended.
Super ARS-520M-NRL, 2U UP MegaDC with 4 + 8 hot-swap 3.5"/2.5" NVMe/SAS/SATA drives
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Key Applications: Hyperscale Data Center ; Object Storage ; Database Processing ; Key Features: 1. Single Socket Ampere® Altra® Processor (Up to 80 Cores; Up to 3.3Ghz) / Single Socket Ampere® Altra® Max Processor (Up to 128 Cores; Up to 3.0Ghz) ; Up to 250W TDP ; 2. 16 DIMMs; Up to 4TB ECC Registered DDR4-3200MHz RDIMM/LRDIMM ; 3. 3x PCIe 4.0 x16 (LP) Slots, 1 AIOM Slot (OCP3.0 Mezzanine Compatible) ; 4. 2x 25Gb LAN SFP28 Ports via Mellanox ConnectX®-4 Lx EN Controller ; 5. 12x 3.5" Hot-Swap Drive Bays (4x Hybrid +8x SAS/SATA). Optional up to 4x 2.5" drive bay at the rear ; 6. 1x VGA, 1 (Serial) Micro USB Port, 2 USB3.0 (2 Rear)
Super AS-3015MR-H8TNR,8x Nodes/AMD AM5,Video,I/O Hub,2x HS 2.5" or 3.5" Bays,IPMI,D5/128GB,3U/R2200W
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Key Applications Cloud Computing Web/Collocation Services Web Cache, CDN, Video Streaming Social Networking, Downloads Corporate - WINS, DNS, Print, Login Key Features 8 set of AMD Ryzen (Zen4) CPU, AM5 Socket, LGA-1718. AMD Knoll - Integrated I/O Controller Hub 8 set of Up to 128GB ECC/non ECC UDIMM; DDR5 5200MHz, in 4 DIMM sockets 8 set of PCIe 5.0 x8 (in x16 slot) low profile slot and 8 set of Micro-LP slots (MicroLP upgradable) 8 set of 2x Front Hot-swappable 3.5" SATA3 HDD or Hybrid 2x 2.5" SAS/SATA3/NVMe U.2 drives w/ option kits 2200W Redundant 80+ Titanium Level high-efficiency power supplies
Super AS-4021GA-62R+F, 2x Opt/6C, 4x GPU Slots,Video,2x GB Lan,8x HS SAS2,DDR2(128GB), 4U RM, R1400W
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Key Features 1. Two Six-Core / Quad-Core AMD Opteron¿ 2000 Series (Socket F) support; HT3.0 Link support 2. Dual AMD SR5690 + SP5100 Chipset PCI-E Gen2 support 3. Up to 128GB Registered ECC DDR2 800/667/533 SDRAM in 16 DIMM 4. Intel® 82576 controllers, Dual-Port GbE 5. Up to Four GPU cards 6. 4x PCI-e 2.0 x16, 2x PCI-e 2.0 x4 (in x8 slot), and 1x PCI slot 7. LSI 2008 8 port SAS2 controller, RAID 0, 1, 10; RAID 5 Optional 8. 8x 3.5" Hot-swap SATA Drive Bays, 3x 5.25" Drive Bays 9. Integrated Matrox G200eW 16MB Graphics 10. IPMI 2.0 with Dedicated LAN support 11. High-efficiency 1400W Redundant Power Supplies (80 Plus Gold)
Super AS-4021M-32R, 2x Opt/QC, 2x PCI-e(x8), Video, 2x GB Lan, 8x HS SAS, DDR2(64GB), 4U RM, R800W
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Key Features 1. Two Quad-Core / Dual-Core AMD Opteron¿ 2000 Series (Socket F) Support, 1000 MHz HyperTransport Link 2. nVidia MCP55 Pro / AMD 8132 Chipset 3. 8 x 3.5" Hot-swap SAS / SATA Drive Bays 4. Up to 64GB DDR2 800/667/533 SDRAM 5. 2 (x8) PCI-e, 1 (x4) PCI-e (in x8 slot), 1 64-bit 133MHz PCI-X, 2 64-bit 133/100MHz PCI-X 6. Dual-port Gigabit LAN/Ethernet Controller 7. 800W Redundant Power Supply
Super AS-4021M-82R+, 2x Opt/QC, 2x PCI-e(x8), Video, 2x GB Lan, 8x HS SCSI, DDR2(128GB), 4U RM,R800W
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Key Features 1. Two Quad-Core / Dual-Core AMD Opteron¿ 2000 Series (Socket F) Support, 1000 MHz HyperTransport Link 2. Up to 128GB DDR2 800/667/533 SDRAM; 16 DIMM Sockets 3. 2 x8 PCI-e, 2 64-bit 133/100MHz PCI-X, 2 64-bit 100MHz PCI-X 4. nVidia MCP55 Pro / NEC uPD720400 Chipset 5. 8x 3.5" Hot-swap U320 SCSI Drive Bays 6. Dual-port Gigabit LAN/Ethernet Controller 7. 800W Redundant Power Supply
Super AS-4021M-T2R+, 2x Opt/QC, 2x PCI-e(x8), Video, 2x GB Lan, 8x HS SATA, DDR2(128GB), 4U RM,R800W
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Key Features 1. Two Quad-Core / Dual-Core AMD Opteron¿ 2000 Series (Socket F) Support, 1000 MHz HyperTransport Link 2. Up to 128GB DDR2 800/667/533 SDRAM; 16 DIMM Sockets 3. 2 x8 PCI-e, 2 64-bit 133/100MHz PCI-X, 2 64-bit 100MHz PCI-X 4. nVidia MCP55 Pro / NEC uPD720400 Chipset 5. 8 x 3.5" Hot-swap SATA Drive Bays 6. Dual-port Gigabit LAN/Ethernet Controller 7. 800W Redundant Power Supply
Super ASG-1014S-ACR12N4H,1xEPYC7003,3xPCIe4,Video,2x10GB,12x3.5"+4x2.5" HS,IPMI,D4(4TB),1U RM,R800W
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Key Applications - Database Applications - Hyperscale Data Center - Object Storage - Big Data Analytics - Scale-Out Density - Hadoop & Ceph storage solutions - Scale-out NAS Key Features Single AMD EPYC¿ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 16 DIMMs; Up to 4TB 3DS ECC Registered DDR4-3200MHz RDIMM/LRDIMM 2 PCI-E 4.0 x16 (FHHL) Slots, 1 PCI-E 4.0 x16 (LP) Slot 2x 10GBase-T LAN Ports via Broadcom BCM57416 Controller 12x 3.5" SAS3/SATA3 Hot-Swap Drive Bays, 4x 2.5" 7mm U.2 NVMe Hot-Swap Drive Bays 800W Redundant Power Supplies Platinum Level High-efficiency (Full redundancy based on configuration and application load.) RAID support via Broadcom® 3916
Super ASG-1115S-NE316R, 1xEPYC/9004,VGA,2xPCIe 5.0+2xAIOM,16x E3.S HS NVMe,IPMI,D4(6TB),1U RM,R1600W
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Key Features Single Socket SP5 4th Generation AMD EPYC 9004 Scalable processors. Up to 300W TDP. Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 16x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 1600W Power Supplies
Super ASG-2115S-NE332R,1xEPYC/9004,VGA,2xPCIe 5.0+2xAIOM,32x E3.S HS NVMe,IPMI,D4(6TB),2U RM,R2000W
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Key Applications Software-defined Storage In-Memory Computing Data Intensive HPC Private & Hybrid Cloud NVMe Over Fabrics Solution Key Features Single Socket SP5 AMD EPYC¿ 9004 Series processors. Up to 350W TDP. Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 32x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 2000W Power Supplies
Super All-Flash E3.S NVMe 5thGen Scalable Server
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Supermicro All-Flash EDSFF and NVMe: Highest Performing Storage Solutions for Advanced Computing. Highlights: *Highest storage throughput performance and application responsiveness, *Broad support of advanced form-factors including EDSFF and U.2, *Petabyte-scale all-flash NVMe storage in 1U for extreme density and capacity. Innovations: *Servers Optimized for Maximum Capacity or Highest Throughput Performance, *Storage Enclosures Available for Easy Capacity Expansion, *Mission Critical All-Flash Solutions for Dual-Port NVMe SSDs, Optimized for: *Enterprise Applications, *Data Center, *Hyperscale/Hyperconverged, *Software-defined Storage, *Data Warehousing.
Super All-Flash NVMe 3rdGen Storage Server
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Optimize Your Cloud, AI, and 5G Infrastructure with the Industry's Broadest Portfolio of All-Flash NVMe, Top-Loading, and High-Density Storage Systems. Highlights: Highest storage throughput performance and application responsiveness, Broad support of advanced form-factors including EDSFF and U.2, Petabyte-scale all-flash NVMe storage in 1U for extreme density and capacity. Innovations: Servers Optimized for Maximum Capacity or Highest Throughput Performance, Storage Enclosures Available for Easy Capacity Expansion, Mission Critical All-Flash Solutions for Dual-Port NVMe SSDs. Optimized for: Enterprise Applications, Data Center, Hyperscale / Hyperconverged, Software-defined Storage, Data Warehousing. ***Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 1 CPU, 2 DIMMs and 4 NVMe U.2 drives).
Super BigTwin SYS-222BT-HER, 2U 4-Node BigTwin with 8 hot-swap E3.S 1T NVMe drives per node
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Key Applications - All-Flash NVMe Hyperconverged Infrastructure - Container-as-a-Service; Application Accelerator - High-Performance File System - Diskless HPC Clusters Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot - Up to 2 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1 - Up to 6 front hot-swap 2.5" PCIe 5.0 NVMe drive bays
Super BigTwin(2xNode) 3rdGen Scalable+3.5" Server
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Supermicro TECHTALK: Highly-Configurable Multi-Node Servers: Supermicr's extremely popular BigTwin® and TwinPro multi-node servers are now even better with 3rd Gen Intel® Scalable processors and PCIe Gen 4., we will highlight the range of CPU, memory, Storage, and networking options available on these highly versatile systems. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (for optimal performance, 16 DIMMs are recommended per node). Minimum requirement is 2 CPUs, 2 DIMMs and 1 NIC per node.
Super BigTwin(2xNodes)+2.5 Scalable Server
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The Supermicro BigTwin is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro's Twin architecture is fully optimized for today's diverse workloads and architected for further technology breakthroughs. *Performance: Supporting the latest Intel® Xeon® Scalable processors up to 205W, the BigTwin achieves incredible performance in a 2U multi-node platform. The latest processors from Intel incorporate Ultra Path Interconnect (UPI) technology for significantly improved communication between CPUs to reduce latency and provide extra bandwidth for intense workloads. *Each node of the BigTwin supports up to 3TB DDR4-2666MHz in 24 DIMM slots for dramatically faster and increased memory capacity compared to previous generations of Twin systems. With up to 12 hot-swappable 2.5" drive bays per node, storage performance is accelerated with options for All-Flash NVMe, SAS or SATA drives. *Density: BigTwin systems boast incredibly high density with up to 4 hot swappable nodes in a 2U form factor, and double the I/O capacity of competitive 2U solutions. Support for Supermicro I/O Module (SIOM) enables flexible networking options of 1G, 10G, 25G, or 100G Ethernet or 100G InfiniBand/Omni-Path and frees up 2 low-profile PCI-E 3.0 x16 expansion slots per node. *Efficiency: Supermicro's Twin architecture is designed with power and cost efficiency in mind. The BigTwin reduces power consumption with shared cooling and power design, leveraging redundant 2200W high efficiency (96%) power supplies. Maximum compute in a 2U system enables data center footprints to be reduced by 50% compared to standard 2U servers with equivalent performance. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU, 2 DIMM, 1 HDD/NVMe and 1 NIC or SIOM card per node).
Super BigTwin(2xNodes)+3.5 Scalable Server
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The Supermicro BigTwin¿ is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro's Twin architecture is fully optimized for today's diverse workloads and architected for further technology breakthroughs. SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 1 HDD/NVMe and 1 SIOM card per node). Please contact your sales rep for special requirements.
Super BigTwin(4xNode) 3rdGen Scalable+2.5" Server
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Supermicro TECHTALK: Highly-Configurable Multi-Node Servers: Supermicr's extremely popular BigTwin® and TwinPro multi-node servers are now even better with 3rd Gen Intel® Scalable processors and PCIe Gen 4., we will highlight the range of CPU, memory, Storage, and networking options available on these highly versatile systems. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (for optimal performance, 16 DIMMs are recommended per node). Minimum requirement is 2 CPUs, 2 DIMMs and 1 NIC per node.