Super 2042G-6RF, 4x 6300/16C,Video, 2x GB Lan, 6x HS SAS2 Bays, IPMI, DDR3(1TB), 2U RM, R1400W/80+
Starting atContact Sales
Key Features 1. Four AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 1TB DDR3 1600MHz ECC Registered DIMM; 32x DIMM sockets 3. LSI 2008 onboard SAS2 controller; RAID 0, 1, 10; RAID 5 optional 4. 2x PCI-e Gen 2.0 x16 slot, 1x PCI-e Gen 2.0 x8 slot, 1x UIO or x8 slot 5. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 6. 6x Hot-swap SAS/SATA Drive Bays 7. 1400W High-efficiency Redundant Power Supplies; 80Plus Gold Certified 8. 6x 4-pin PWM fans with optimal fan speed control
Super 2042G-72RF4, 4x 6300/16C,Video, 4x GB Lan, 6x HS SAS2+R5, IPMI, DDR3(1TB), 2U RM,R1400W/80+
Starting atContact Sales
Key Features 1. Four AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 1TB DDR3 1600MHz ECC Registered DIMM; 32x DIMM sockets 3. 2x PCI-E 2.0 x16 slots 2x PCI-E 2.0 x8 slots (Low profile add-on card) 4. LSI 2208 8-port 6 Gbps SAS2 controller; HW RAID 0, 1, 5, 6, 10, 50, 60 (1GB cache) (60 optional) 5. 6x Hot-swap SAS/SATA Drive Bays 6. 1400W High-efficiency Redundant Digital Power Supplies Platinum Certified (94%) 7. Integrated IPMI 2.0 with Dedicated LAN
Super 2042G-TRF, 4x 6300/16C,Video, 2x GB Lan, 6x HS SATA Bays, IPMI, DDR3(1TB), 2U RM, R1400W/80+
Starting atContact Sales
Key Features 1. Four AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 1TB DDR3 1600MHz ECC Registered DIMM; 32x DIMM sockets 3. 2x PCI-e Gen 2.0 x16 slot, 1x PCI-e Gen 2.0 x8 slot, 1x UIO or x8 slot 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. 6x Hot-swap SATA Drive Bays 6. 1400W High-efficiency Redundant Power Supplies 80Plus Gold Certified 7. 6x 4-pin PWM fans with optimal fan speed control
Super 2048U-RTR4, 4x E5-4600v3,Video, 4x GB LAN, 24x HS 2.5" SAS3(4x NVMe), IPMI, D4(3TB),2U/R1000W
Starting atContact Sales
Key Features ¿ Quad Intel® Xeon® E5-4600 v3 Processors ¿ 48x DDR4 DIMM Slots, up to 3TB ¿ Up to 11x PCI-E 3.0 slots ¿ 4x Hot-Swap NVMe Bays support via optional NVMe AOC ¿ Flexible Connectivity Options 1. Quad socket R3 (LGA 2011) supports Intel® Xeon® processor E5-4600 v3 family; QPI up to 9.6GT/s 2. Up to 3TB ECC, up to DDR4 2133MHz; 48x DIMM slots 3. 9x PCI-E 3.0 x8 slots, 2x PCI-E 3.0 x16 slots 4. 4x GbE + 1x dedicated IPMI LAN ports 5. 24x Hot-swap 2.5" Drive Bays: 4x Hybrid ports with NVMe support via extra AOC 6. 4x 8cm heavy duty fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. ***** Due to the complexity of integration, this product is sold as completely assembled systems only (including but not limited to CPUs, memory, and HDDs). Please contact your sales rep for special requirements.
Super 2049P-TN8R, 4x LGA3647, 7x PCI-e, Video, 1GB LAN,8+2x HS 2.5" U.2 NVMe,IPMI,D4(12TB),2U/R2200W
Starting atContact Sales
Key Features • 4-Way High Core Count VM Optimized • Cloud and Virtualization • Data Center • Scale-Out Density, VOD Delivery 1. Quad Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)¿ 2. 48 DIMMs; up to 12TB 3DS ECC DDR4-2933MHz¿ RDIMM/LRDIMM, Supports Intel® Optane¿ DCPMM¿¿ 3. 5 PCI-E 3.0 x8 slots, 2 PCI-E 3.0 x16 slots 4. 1 GbE LAN ports via Intel i210 1 dedicated IPMI LAN port 5. 2 Hot-swap 2.5" SATA3 drive bays 8 Hot-swap 2.5" U.2 NVMe SSD bays 6. 2 M.2 M key (22110/2280) 7. 4 heavy duty fans with optimal fan speed control 8. 2200W Redundant Power Supplies Titanium Level (96%). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 4 CPUs, 4 DIMMs and 1 HDD recommended). Please contact your Supermicro sales rep for special 2 CPUs with 2 DIMMs requirements with fees.
Super 2049U-TR4, 4x LGA3647, 11x PCI-e,Video,4x 1GB,24x HS 2.5" SATA3(C621)+R,IPMI,D4(6TB),2U/R1600W
Starting atContact Sales
Key Features ¿ 48 DDR4 DIMM Slots, up to 6TB ¿ Up to 11 PCI-E 3.0 slots ¿ 4 Hot-Swap NVMe Bays support via optional NVMe AOC ¿ Flexible Connectivity Options 1. Quad socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 6TB 3DS LRDIMM, up to DDR4-2666MHz; 48 DIMM slots 3. 5 PCI-E 3.0 x8 slots, 6 PCI-E 3.0 x16 slots 4. 4 GbE LAN ports via AOC-2UR66-i4G 1 dedicated IPMI LAN port 5. 24 Hot-swap 2.5" SAS3/SATA3 drive bays supported via optional Add-on RAID controller card; 4 Hybrid ports with NVMe support via extra AOC 6. 4x 8cm heavy duty fans 7. 1600W Redundant Power Supplies Titanium Level (96%). SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (including but not limited to CPUs, memory, and HDDs). Please contact your Supermicro sales rep for special requirements.
Super 210GP-DNR,1x LGA-4189,3xGPUs,Video,AIOM,2x HS 2.5" U.2 NVMe,2x M.2,IPMI,D4(2TB),2U/R2500W
Starting atContact Sales
Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processor Intel® C621A Chipset 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3 PCI-E Gen 4.0 x16 FHFL DW 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 2 M.2 NVMe and SATA for boot drive only 2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load) AST2500 BMC
Super 210GT-HNC8F,4xNode,1xLGA-4189,GrandTwin I/O M,AIOM,4xHS 2.5" SAS3(3808),IPMI,D4(6TB),2U/R2200W
Starting atContact Sales
Key Applications - Multi-Purpose CDN - High-availability Cache Cluster - Telco Edge Cloud - EDA (Electric Design Automation) - Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP Intel® C621A Up to 16 DIMM Slots or 4TB (with Intel® Optane¿ Persistent Memory support) Optional: AIOM PCI-E 4.0 x16 LP (OCP 3.0 compliant) Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE Up to 4 Hot-swap 2.5" SAS/SATA drives 2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design Built-in SAS3 Support via Broadcom 3808; IT Mode
Super 210GT-HNTF,4x Nodes,1xLGA-4189,GrandTwin I/O M,AIOM,4xHS 2.5" SATA/NVMe,IPMI,D4(6TB),2U/R2200W
Starting atContact Sales
Key Applications - HPC - Cloud Gaming - MEC (Multi-Access Edge Computing) - Multi-Purpose CDN - High-availability Cache Cluster Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP Intel® C621A Up to 16 DIMM Slots or 4TB (with Intel® Optane¿ Persistent Memory support) Optional: AIOM PCI-E 4.0 x16 LP (OCP 3.0 compliant) Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE Up to 4 Hot-swap 2.5" NVMe/SATA drives 2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Super 210P-FRDN6T,1xLGA-4189,3xPCIe4.0,Video,2x10GB+4xGB,2xInt 2.5" Bay,IPM,D4(2TB),2U/R600W,DC-48V
Starting atContact Sales
Key Applications - 5G Core and Edge - AI Inference and Machine Learning - Network Function Virtualization - Cloud Computing Key Features Single Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors 8 DIMM slots; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM Up to 3 PCI-E 4.0 FHHL & 2 HHHL expansion slots for Accelerator Add-On-Cards Onboard 2x 10GbE ports & 4x 1GbE ports 2x Internal 2.5" drive bays for SATA drives Redundant 600W DC -48V Power Supplies Ultra short depth, 2U Front I/O Edge Server
Super 210SE-31A,3xNodes,1xLGA-4189,3x PCIE Gen4 x16,Video,1xGb,2x NVMe M.2,IPMI,D4(2TB),2U/R2200W
Starting atContact Sales
Key Applications - Multi-Access Edge Computing - Flex-RAN, Open-RAN vBBU - Telecom DRAN, CRAN, and Edge Core Application - Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM (per node) 2 PCI-E Gen4 x16 FHHL slot and 1 PCI-E Gen4 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 210SE-31D,3xNodes,1xLGA-4189,3x PCIE Gen4 x16,Video,1xGb,2x NVMe M.2,IPMI,D4(2TB),2U/R200W DC
Starting atContact Sales
Key Applications - Multi-Access Edge Computing - Flex-RAN, Open-RAN vBBU - Telecom DRAN, CRAN, and Edge Core Application - Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM (per node) 2 PCI-E Gen4 x16 FHHL slot and 1 PCI-E Gen4 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 210TP-HPTR,4xNode,1xLGA-4189,Video,2x10Gb/SFP+/X710,6xHS 2.5" SATA Bays,IPMI,D4(2TB),2U/R2KW
Starting atContact Sales
Key Applications - Multi-Access Edge Computing - Flex-RAN, Open-RAN vBBU - Telecom DRAN, CRAN, and Edge Core Application - Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node) Intel® C621A Chipset 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM (per node) 2 PCI-E Gen4 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) Front hot-swappable 2.5¿ HDD/SSD tray (6 tay per node) 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System) 1+1 Redundant 2000W Titanium Level AC Power Supplies (per system) Intel® X710 Dual port 10G SFP+ onboard
Super 210TP-HPTRD,4xNode,1xLGA-4189,Video,2x10Gb/SFP+/X710,6xHS 2.5" SATA,IPMI,D4(2TB),2U/R2KW DC
Starting atContact Sales
Key Applications - Multi-Access Edge Computing - Flex-RAN, Open-RAN vBBU - Telecom DRAN, CRAN, and Edge Core Application - Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processor (per node) Intel® C621A Chipset 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM (per node) 2 PCI-E Gen4 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) Front hot-swappable 2.5¿ HDD/SSD tray (6 tay per node) 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System) 1+1 Redundant 2000W DC Power Supplies (per system) Intel® X710 Dual port 10G SFP+ onboard
Super 2113S-WN24RT,1x AMD 7000,Video,2x 10GB/BCM57416,24x HS 2.5" U.2 NVMe,IPMI,D4(2TB),2U RM,R1200W
Starting atContact Sales
Key Features ¿ Virtualization ¿ Hyperconverged Storage ¿ Cloud Computing ¿ All Flash Storage 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)   (Full redundancy based on configuration   and application load). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with 1 CPU, minimum 4 DIMMs, at least 1 NVMe). Recommended configuration for best performance is at least 1 DIMM per channel (8 DIMM Total). Please contact your sales rep for special requirements.
Super 2113S-WTRT, 1x AMD 7000, Video, 2x 10GB Lan,16x HS 2.5" SATA3 Bays,IPMI,DDR4(2TB),2U RM,R1200W
Starting atContact Sales
Key Features ¿ Backup Storage ¿ Web or Database Servers ¿ Compact Network Appliance 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot,   2 PCI-E 3.0 x8 (FH/HL) slots,   2 PCI-E 3.0 x8 (LP) slots   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 16 hot-swap 2.5" SATA3 drive bays, or   10 hot-swap 2.5" SATA3 drive bays +   optional 6 U.2 NVMe drive support with   additional cables 7. 1200W Redundant Power Supplies   Titanium Level (96%)   (Full redundancy based on configuration   and application load)
Super 2114GT-DNR,2xNodes,1xEPYC 7003,Video,1xAIOM,2x HS 2.5" U.2 NVMe Gen4,IPMI,D4(2TB),2U RM,R2600W
Starting atContact Sales
Key Applications - Media/Video Streaming - AI Inference and Machine Learning - Cloud Gaming - Industrial Automation, Retail, Smart Medical Expert Systems Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single AMD EPYC¿ 7003/7002 Series Processor (The latest AMD EPYC¿ 7003 Series Processor with AMD 3D V-Cache¿ Technology requires BIOS version 2.3 or newer) 2. 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3. Up to 6 PCI-E Gen 4 x16 (4 internal, 2 external) slots, 1 PCI-E 4.0 x8 AIOM slot M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4. Integrated IPMI 2.0 + KVM with  dedicated LAN ¿ Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7. 2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Super 2114GT-DPNR,2x Nodes,Ryzen 5KWX,Video,1xAIOM,2xHS 2.5" U.2 NVMe Gen4,IPMI,D4(2TB),2U RM,R2600W
Starting atContact Sales
Key Applications - Media/Video Streaming - AI Inference and Machine Learning - GPU Virtualization (VDI) - Industrial Automation, Retail, Smart Medical Expert Systems Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. AMD Ryzen¿ Threadripper¿ PRO 5000WX/3000WX Series Processor, up to 64 Cores 2. 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3. 2 PCI-E Gen 4 x16 external slots, 1 PCI-E 4.0 x8 AIOM slot (or optional x16 AIOM w/ additional parts) M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4. Integrated IPMI 2.0 + KVM with  dedicated LAN ¿ Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7. 2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Super 2114S-WN24RT,1x AMD 7002,Video,2x 10GB/BCM57416,24x HS 2.5" U.2 NVMe,IPMI,D4(4TB),2U RM,R1200W
Starting atContact Sales
Key Features ¿ Virtualization ¿ Hyperconverged Storage ¿ Cloud Computing ¿ All Flash Storage 1. Single AMD EPYC¿ 7002-Series Processor 2. Up to 4TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)   (Full redundancy based on configuration   and application load). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with 1 CPU, minimum 4 DIMMs, at least 1 NVMe). Recommended configuration for best performance is at least 1 DIMM per channel (8 DIMM Total). Please contact your sales rep for special requirements. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with 1 CPU, minimum 8 DIMMs, 1 NVMe). Recommended configuration for best performance is at least 24 or 32 Cores per CPU.
Super 2115GT-HNTF,4xNodes,1xAMD 9004,Video,AIOM/OCP3.0,4xHS 2.5" NVMe Bays,IPMI,D4(3TB),2U RM,R2200W
Starting atContact Sales
Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, AMD EPYC¿ 9004 Series Processors up to 360W TDP 12 DIMM Slots , up to 3TB DDR5 memory Flexible bays for either Storage or AIOM / OCP 3.0 slots Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE Up to 4 Hot-swap 2.5" NVMe/SATA drives