Super 120C-TR,2xLGA-4189,4xPCIe4.0,Video,LAN via Slim-AIOM,8xHS 2.5" SATA3 Bay,IPMI,D4(6TB),1U/R860W
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Key Features Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Intel® C621A Chipset 16 DIMMs up to 6TB 3DS ECC DDR4-3200: LRDIMM/RDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 FHHL; 2 PCI-E 4.0 x16 AIOM (OCP 3.0); 2 PCI-E 3.0 x2 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 8x 2.5" hot-swap SATA/SAS drive bays 6 counter-rotating 4 cm PWM fans with optimal fan speed control, 2 air shrouds 860W redundant Platinum level 100-240Vac and 200-240 Vdc power supplies 1 VGA, 1 COM, 2 USB 3.0 (rear). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with Minimum 2 CPUs, 4 DIMMs and 1 Storage Device HDD/HDS/M.2, and 1 NIC).NIC requirement can either be AIOM or PCIe card.
Super 120GQ-TNRT,2x LGA-4189,6xPCIe4.0,Video,2x10Gb,2xHS 2.5" NVMe+2x2.5" Fixed,IPMI,D4(4TB),1U/R2KW
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Key Applications - Scientific Virtualization - Rendering Key Features 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane¿ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane¿ Persistent Memory 200 series 6 PCI-E Gen 4.0 x16 (4 FHFL & 2 LP) 1 M.2 NVMe Supported 2x 2.5" NVMe Hot-swap drive bays 2x 2.5" SATA Internal Fixed drive bays 9 counter rotating fans w/ Optimal Fan Speed Control 2x 2000W redundant Titanium level power supplies
Super 120H-TNR,2xLGA-4189,3xPCIe4.0,Video,LAN via Slim-AIOM,8xHS 2.5" SAS/NVMe,IPMI,D4(8TB),1U/R12KW
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Key Applications - Virtualization - Software-defined Storage - AI Inference and Machine Learning - Cloud Computing - Enterprise Server Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane¿ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane¿ Persistent Memory 200 series 3 PCI-E 4.0 x16 slots with support for GPU/Accelerator cards Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card 8 heavy duty hot-swap fans with optimal fan speed control. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with Minimum 2 CPUs, 4 DIMMs and 1 Storage Device HDD/HDS/M.2, and 1 NIC).
Super 120TP-DC8TR,2xNode,2xLGA-4189,Video,2x10Gb/X710,4xHS 2.5" SAS3(S3808L)+R,IPMI,D4(4TB),1U/R1KW
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Key Applications High Performance Computing Hyper-Converged Infrastructure Big Data / Big Science Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors Intel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm) Intel® X710 Dual port 10GBase-T LAN onboard
Super 120TP-DC9TR,2xNode,2xLGA-4189,Video,2x10Gb/X710,4xHS 2.5" SAS3(S3908L)+R,IPMI,D4(4TB),1U/R1KW
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Key Applications - High Performance Computing - Hyper-Converged Infrastructure - Big Data / Big Science Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors Intel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 1 PCI-E 4.0 x16 (LP), 1 PCI-E 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm) Intel® X710 Dual port 10GBase-T LAN onboard 4x 2.5" hot-swap SATA/SAS drive bays 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System) Two 1000W redundant power supplies with PMBus ASPEED AST2600 BMC, 2 USB, VGA. RoT Broadcom® 3908 SAS (12Gbps); 4 slots per node; RAID 0, 1, 5, 6, 10 support.
Super 120TP-DTTR,2xNode,2xLGA-4189,Video,2x10Gb/X710,4xHS 2.5" SATA3(C621A)+R,IPMI,D4(4TB),1U/R1KW
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Key Applications High Performance Computing Hyper-Converged Infrastructure Big Data / Big Science Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors Intel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 2 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm) Intel® X710 Dual port 10GBase-T LAN onboard 4x 2.5" hot-swap SATA drive bays
Super 120U-TNR, 2x LGA-4189,3xPCIe4.0,Video,LAN via Slim-AIOM,12xHS 2.5" SAS/NVMe,IPMI,D4(8TB),R12KW
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Key Applications - Virtualization - HPC - Cloud Computing - High End Enterprise Server - Software Defined Storage - Application Tier Service Provider - 5G/Telco Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane¿ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane¿ Persistent Memory 200 series 1 Internal PCI-E 4.0 x16 1 PCI-E 4.0 x16 (LP) 2 PCI-E 4.0 x16 (FH, 10.5"L) Flexible networking options 12x2.5" hot-swap hybrid NVMe/SATA/SAS drive bays 8 heavy duty fans with optimal fan speed control 1200W redundant Titanium level power supplies. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs, 1 Storage Device HDD/HDS/M.2, and 1 NIC adapter*). *NIC adapter requirement includes either 1 Ultra Riser card with integrated NIC or 1 AOC-URG4N4 Ultra Riser card with 1 standard PCI-E NIC adapter.
Super 121C-TN10R,4th Gen2xLGA-4677,4xPCIe5.0,Video,2xAIOM,10xHS 2.5" SAS3/NVMe,IPMI,D5(4TB),1U/R860W
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Key Applications Web Server, Firewall Application Data Center Optimized, Value IaaS Cloud Computing, Compact Server DNS & Gateway Servers, Firewall Application CDN, Edge Nodes Key Features Dual sockets E (LGA-4677) 4rd Gen Intel® Xeon® Scalable processors 16 DIMMs up to 4TB 3DS ECC DDR5-4800: RDIMM 2 PCIe 5.0 x16 FHHL; 2 PCIe 5.0 x16 AIOM (OCP 3.0); 2 PCIe 5.0 x4 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
Super 121C-TN2R,4th Gen2xLGA-4677,4xPCIe5.0,Video,2xAIOM,8xHS 2.5" SAS3/NVMe,IPMI,D5(4TB),1U/R860W
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Key Applications Web Server, Firewall Application Data Center Optimized, Value IaaS Cloud Computing, Compact Server DNS & Gateway Servers, Firewall Application CDN, Edge Nodes Key Features Dual sockets E (LGA-4677) 4rd Gen Intel® Xeon® Scalable processors 16 DIMMs up to 4TB 3DS ECC DDR5-4800: RDIMM 2 PCIe 5.0 x16 FHHL; 2 PCIe 5.0 x16 AIOM (OCP 3.0); 2 PCIe 5.0 x4 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
Super 121E-NE316R,4thGen2xLGA-4677,2xPCIe5.0,Video,2xAIOM,16xE3.S HS NVMe,M.2,IPMI,D5(8TB),1U/R1600W
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Key Features Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 12TB memory capacity with 16 DIMMs of 256Gb 3DS RDIMM/RDIMM DDR5 ECC memory and 16 DIMMs of 512Gb Intel® Optane PMem 300 Series Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 16x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 1600W Power Supplies
Super 121E-NES24R,4th Gen 2xLGA-4677,4xPCIe5.0,Video,2xAIOM,24xE1.S HS NVMe,M.2,IPMI,D5(8TB),1U/R2KW
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Key Applications Software-defined Storage In-Memory Computing Data Intensive HPC Private & Hybrid Cloud NVMe Over Fabrics Solution Key Features Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 12TB memory capacity with 16 DIMMs of 256Gb 3DS RDIMM/RDIMM DDR5 ECC memory and 16 DIMMs of 512Gb Intel® Optane PMem 300 Series Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 24x hot-swap E1.S (9.5mm or 15mm) NVMe drive bays Redundant Titanium 2000W Power Supplies
Super 2013S-C0R,1xAMD7000,6xPCIe+M.2,Video,2xGB/210,8xHS SAS3(3008/IR mode),IPMI,D4(1TB),2U RM,R740W
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Key Features ¿ Cloud and Virtualization needs ¿ Connectivity/Storage    Computer Nodes ¿ Database Processing & Storage ¿ High End Enterprise Server ¿ Hosting & Application delivery 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 1TB Registered ECC DDR4   2666MHz SDRAM in 8 DIMMs 3. Expansion slots:    3 PCI-E 3.0 x16 (low profile);    3 PCI-E 3.0 x8 (low profile)    M.2 Interface: PCI-E 3.0 x4     (NVMe based)    M.2 Form Factor: 2280, 22110    M.2 Key: Onboard M-key    Number of M.2: Single 4. IPMI 2.0 + KVM with dedicated LAN 5. 2x 1GbE LAN ports via Intel® I210 6. 8 hot-swap 3.5" SAS3/SATA3 Drive Bays   (on-board Broadcom 3008 IR mode),   1 M.2 NVMe SSD slot Supported 7. 740W Redundant Platinum Level   high-efficiency Power Supplies   (Full redundancy based on configuration   and application load)
Super 2014CS-TR, 1xAMD 7003,4xPCIe 4.0,VGA,LAN via 2xAIOM,12x HS SATA3 Bays,IPMI,D4(4TB),2U RM,R920W
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Key Applications - Financial Services - Cloud Computing - Network Appliance - Private Cloud - Content Delivery Network (CDN) - Deep Learning Inferencing Key Features 1. Single AMD EPYC¿ 7002/7003 Series Processor 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. Expansion slots: 4 PCI-E 4.0 x16 (FH, 10.5" L) slots,  or 2 PCI-E 4.0 x16 (FHHL) + 4 PCI-E 4.0 x8   (FHHL) slots; 2 AIOM slots for flexible networking  (One x8 AIOM slot and one x16 AIOM slot) 4. Integrated IPMI 2.0 + KVM with dedicated LAN ¿ Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5. 12 Hot-swap 3.5" SATA3/SAS3/NVMe drive bays:  12 SATA3 by default  or 8 SATA3 + 4NVMe via optional cables  or 12 SAS3 via optional SAS kit; Optional 2x 2.5" peripheral drive bays via  rear drive bay kits M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 6. 2 USB 3.0 ports (rear), 1 VGA, 1 COM, ASPEED AST2600 BMC graphics 7. Tool-less Drive Trays and Tool-less Brackets 8. 920W Redundant Platinum Level Power Supplies (Full redundancy based on configuration and application load)
Super 2014S-TR, 1xAMD 7003,7xPCIe 4.0,VGA,2x GB LAN,12x HS SATA3 Bays,2xM.2,IPMI,D4(2TB),2U RM,R920W
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Key Applications - Backup storage - Web or Database Servers - Compact Network Appliance Key Features 1. Single AMD EPYC¿ 7002/7003 Series Processor 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 5 PCI-E 4.0 x16 LP slots, 2 PCI-E 4.0 x8 LP slots 4. 2x 1GbE LAN ports, 1 dedicated IPMI LAN port 5. 12 Hot-swap 3.5" SATA3 drive bays, 2 rear Hot-swap 2.5" SATA3 Drive bays  via optional kit M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 6. 6 USB 3.0 ports (4 rear, 2 via header), 1 VGA, 1 COM, ASPEED AST2500 BMC graphics 7. 920W Redundant Platinum Level Power Supplies (Full redundancy based on configuration and application load)
Super 2014TP-HTR, 4x Nodes, 1x AMD 7002, Video,1xSIOM,3xHS 3.5" SATA3 Bays,IPMI,D4(2TB),2U RM,R2000W
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Key Features - Compute Intensive Applications - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single AMD EPYC¿ 7002 Series Processor 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3. 2 PCI-E 4.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. Integrated IPMI 2.0 + KVM with  dedicated LAN ¿ Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 3 Hot-swap 3.5" SATA3 drive bays M.2 Interface: 4 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110, 2260, 2242 M.2 Key: M-key 6. Video via Aspeed AST2500 BMC 7. 2000W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Super 2015A-TR,1xAMD Ryzen 7000 ,Video,2xGB,8xHS 3.5"/2.5" SAS/SATA,2xM.2,IPMI,D5(128GB),2U RM,R800W
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Main Navigation (Enterprise) Products Solutions Company Support Buy Breadcrumb » Products » Systems » Mainstream Datasheet Share IconShare Key Applications Designed for financial companies AMD Xilinx Solarflare X2 and X3 Ethernet adapters validated Key Features AMD Ryzen¿ 7000 Series LGA1718 up to 170W TDP Processors 4x DDR5 UDIMM Slots, ECC/Non-ECC DDR5-5200 Up to total 128GB 2x PCIe 5.0 x16 (FHHL) slots (16/NA or 8/8) 2x 1GbE LAN (Intel® I210-AT) IPMI 2.0 + KVM with Dedicated LAN (1GbE) 800W High-Efficiency Power Supply Titanium Level Certified
Super 2015CS-TNR,1xEPYC/9004,Video,2xAIOM LAN,12xHS 3.5"/2.5" NVMe/SAS/SATA,IPMI,D4(3TB),2U RM,R860W
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Key Features Single 4th Generation AMD EPYC¿ 9004 Series Processors 12 DIMM slots up to 3TB 3DS ECC RDIMM DDR5-4800MHz 2 PCI-E 5.0 x16 FHFL 2 PCI-E 5.0 x16 FHHL Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 12x 3.5/2.5" hot-swap hybrid NVMe/SATA/SAS drive bays
Super 2015SV-WTNRT,1xAMD 8004,WIO,4xPCI5,Video,2x10GB,12xHS SATA/NVMe/SAS,IPMI,D5(576GB),1U RM,R800W
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Key Applications Virtualization Data Center Optimized Firewall Applications Database/Storage Edge/Cloud Computing Services Key Features Single Socket AMD EPYC¿ 8004 Series Processor 6 DIMM slots, DDR5-4800MHz memory, support up to 576GB 1x dedicated IPMI LAN, 2x 10GbE BaseT LAN ports via Broadcom BCM57416 Controller 12 hot-swap 3.5" drive bays support SATA(default)/NVMe/SAS drives or 6 SATA/NVMe Hybrid with 6 SATA drives (Optional cables or SAS controller card for NVMe and SAS drives support) Dual 800W Redundant Titanium Level Power Supplies
Super 2015TA-HTRF, 8x Nodes, Atom-D525, Video, 2x GB Lan, 3x 2.5" HS,IPMI,DR3/4GB,2U/R720W(1+1),80+
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Key Features Eight (8) Nodes in 2U. Two (2) Nodes per Single Hot-swap tray. Optimized for High Density and Low Power consumption UP Atom Server. 1. Intel® Atom¿ D525 (Pineview-D) Dual Core, 1.8GHz (13W) processor 2. Intel® ICH9R Express Chipset 3. 4GB non-ECC DDR3 800MHz SO-DIMM (per node); support total up to 32GB 4. 3x 2.5" Hot-swap SATA HDD per node; total of 24x HDDs (RAID 0, 1, 5) 5. 2x Intel 82574L Gigabit Ethernet LAN 2x RJ45 LAN ports per node 6. Integrated IPMI 2.0 with shared LAN 7. (1+1) Redundant 720W Gold Level power supply with PMbus 8. "Cable-Free" Twin Architecture
Super 2016Ti-HTRF, 4x Nodes, Xeon 3400, Video, 2x GB Lan, 6x 2.5" HS,IPMI,DR3/32GB,2U/R920W(1+1),80+
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Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Intel® Xeon® X3400 / L3400 series, Core¿ i3 & Pentium® processors with LGA 1156 socket 2. Up to 32GB DDR3 1333/1066/800MHz ECC Registered DIMM or 16GB Unbuffered DIMM 3. 1 (x16) PCI-E 2.0 (Low Profile AOC) 4. Integrated IPMI 2.0 with KVM and Dedicated LAN 5. High performance Intel® 82576BE dual port Gigabit LAN 6. 6x 2.5" Hot-swap SATA2 Drive Bays 7. 920W Platinum Level 94% efficiency Redundant (1+1) power supplies