Super E403-9D-14CN-FRN13+,D-2177NT-1.9Ghz/14C/28T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,R800W
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2177NT Processor, 14 Cores, 28 Threads, 1.9 GHz, 105W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 800W Redundant Power Supplies Platinum Level Certified
Super E403-9D-16C-FN13TP,D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
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Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9D-16C-FRDN13+,D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,600W DC
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W -48V DC input Redundant Power Supplies
Super E403-9D-16C-FRN13+,D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,R800W
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 800W Redundant Power Supplies Platinum Level Certified
Super E403-9D-16C-IP, Xeon D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Rack2U/600W
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Key Applications • 5G Radio Access Network (RAN) • Multi-Access Edge Computing (MEC) • Edge AI Inferencing • Vehicle to Everything (C-V2X/V2X) • Virtualized Functions and Services Key Features 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Operating Temperature -40°C ~ 46°C + Solar load (-40°F ~ 114.8°F + Solar load) 3. GR-487-CORE compliant 4. Tamperproof design 5. Noise 71 dBA 6. 100-240 Vac, Est. Max Power consumption: 1200W (instantaneous)/ 900W (stable) 7. 620W heater (Initiating power: 900W)
Super E403-9D-4C-FN13TP,D-2123iT-2.2Ghz/4C/8T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
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Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9D-4C-FRDN13+,D-2123iT-2.2Ghz/4C/8T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,600W DC
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W -48V DC input Redundant Power Supplies
Super E403-9D-4C-FRN13+,D-2123iT-2.2Ghz/4C/8T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,R800W
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Key Features 1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W -48V DC input Redundant Power Supplies
Super E403-9D-8CN-FN13TP,D-2146NT-2.3Ghz/8C/16T, VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
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Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2146NT Processor, 8 Cores, 16 Threads, 2.3 GHz, 80W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9P-FN2T,1x LGA3647,WIO(3xPCIe),VGA, 2x10G/X722+X557,4x Int 2.5" Bays+M.2,IPMI,Box PC,600W
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Key Features Multi-Access Edge Computing (MEC) Universal Customer Premise Equipment (uCPE) Network Function Virtualization (NFV) Artificial Intelligence (AI) on Edge, Machine Learning (ML) Industrial Automation, Retail, Smart Medical Expert Systems 1. Single Socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processor (Cascade Lake-SP)¿ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots¿ 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110 PCI-E 3.0 x4 and SATA 6. 2x 10GBase-T ports with Intel X722 + X557 7. 1 VGA, 1 COM, 4 USB 3.0, 2 USB 2.0 8. 600W Multi-output Gold Level Power Supply
Super E50-9AP,Atom E3940(9.5W/4C),Video,HD Audio,2xHDMi,2xGB,1x2.5" & M.2,D3 SO-DIMM(8GB),IoT,DC/40W
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Key Features - IoT Gateway - Commercial Appliance - IP51 for water/dust proof 1. Intel® Atom® processor E3940 (9.5W, 4C) Single socket FCBGA 1296 2. System on Chip 3. 1 SATA 3.0 for 7mm 2.5" SATA SSD, 1 M.2 B-Key 2242/3042 for SATA SSD 4. Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket 5. 1 Full size Mini-PCIe, 1 Half size Mini-PCIe, 1 M.2 B-Key 2242/3042, 1 M.2 E-Key 2230 6. Dual LAN with Intel I210-IT 7. 2 USB 3.0, 2 USB 2.0, 2 COM (RS-232/422/485), 1 TPM 2.0 onboard 8. Fanless design 9. Lockable 12V DC 40W power adapter
Super E50-9AP-L,Atom E3940(9.5W/4C),Video,HDAudio,HDMi,2xGB,1xM.2/MiniPCIe,D3 SO-DIMM(8G),IoT,DC/40W
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Key Features - Cost Optimized IoT Gateway - Commercial Appliance 1. Intel® Atom® processor E3940 (9.5W, 4C) Single socket FCBGA 1296 2. System on Chip 3. Up to 8GB Unbuffered Non-ECC SO-DIMM, DDR3L-1866MHz, in 1 socket 4. 1 Half size Mini-PCIe, 1 M.2 B-Key 2242 for SATA SSD 5. Dual LAN with Intel I210-IT 6. 2 USB 3.0, 1 HDMI 7. Fanless design 8. Lockable 12V DC 40W power adapter
Super E50-9AP-N5,Atom E3940(9.5W/4C),Video,HDAudio,HDMi,5xGB,1xM.2/MiniPCIe,D3 SODIMM(8G),IoT,DC/40W
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Key Features - IoT Gateway - Entry Networking Appliance 1. Intel® Atom® processor E3940 (9.5W, 4C) Single socket FCBGA 1296 2. System on Chip 3. 1 SATA 3.0 for 7mm 2.5" SATA SSD, 1 M.2 B-Key 2242 for SATA SSD 4. Up to 8GB Unbuffered Non-ECC SO-DIMM, DDR3L-1866MHz, in 1 socket 5. 1 Half size Mini-PCIe, 1 M.2 B-Key 2242/3042, 1 M.2 E-Key 2230 6. 5 LAN with Intel I210-IT 7. 2 USB 3.0, 2 USB 2.0, 1 COM, 2 HDMI, ALC 888S HD Audio, 1 TPM 2.0 onboard 8. Fanless design 9. Lockable 12V DC 40W power adapter
Super E50-9AP-WiFi,Atom E3940(9.5W/4C),Video,HDAudio,HDMi,2xGB,1x2.5"&M.2,D3 SO-DIMM(8GB),IoT,DC/40W
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Key Features - Built-in Wifi and Antenna - IP51 with plastic chassis design for water/dust proof - Cable-less design for easy maintenance - Fanless design with palm-size dimension 1. Intel® Atom® processor E3940 (9.5W, 4C) Single socket FCBGA 1296 2. System on Chip 3. 1 SATA 3.0 for 7mm 2.5" SATA SSD, 1 M.2 B-Key 2242/3042 for SATA SSD 4. Up to 8GB unbuffered non-ECC SO- DIMM, DDR3L-1866MHz, in 1 socket 5. 1 Full size Mini-PCIe, 1 Half size Mini-PCIe, 1 M.2 B-Key 2242/3042, 1 M.2 E-Key 2230 6. Dual LAN with Intel I210-IT; Dual Band Wireless and Bluetooth 4.2 7. 2 USB 3.0, 2 USB 2.0, 2 COM (RS-232/422/485), 1 TPM 2.0 onboard 8. Fanless design 9. Lockable 12V DC 40W power adapter
Super F1114S-FT,8xNode FT,1xAMD 7003,2xPCIe4,Video,1xAIOM,4x 2.5" Fixed Bays,IPMI,D4(4TB),4U RM,R2KW
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Key Applications - Hyperscale and Hyperconverged Solutions - Cloud Computing - Cluster Node - Data Center - HPC cluster computer nodes Key Features 8 Hot-pluggable System Nodes in a 4U form factor. Each node supports: 1. Single AMD EPYC¿ 7002 Series Processor 2. Up to 4TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 16 DIMM slots 3. Expansion slots: 2 PCI-E 4.0 x16 (LP Riser), 1 PCI-E 4.0 x16 AIOM slot 4. AIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. Up to 4 fixed internal drive bays (2x 3.5" or 4x 2.5") M.2 Interface: 2 SATA/NVMe, PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 7. 8 heavy-duty 8cm 13.5k RPM rear fans per enclosure 8. 2000W or above Redundant Power Supplies (Full redundancy based on configuration and application load). Complete System Only: To maintain quality and integrity, this product is sold only as a completely assembled system (for optimal performance 8 DIMMs is recommended). Minimum requirement is 1 CPU, 4 DIMMs, 1 HDD/NVMe and 1 AIOM/AOC NIC card per node.
Super F1114S-RNTR,8xNode FT,1xAMD 7003,1xPCIe4,Video,1xAIOM,6xHS 2.5" SATA,IPMI,D4(1TB),4U RM,R2200W
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Key Applications - Hyperscale / Hyperconverged - HPC and Big Data - Data Center Enterprise Applications - Scale Out Storage - Telco Data Center - Virtualization Server Key Features 8 Hot-pluggable System Nodes in a 4U form factor. Each node supports: 1. Single AMD EPYC¿ 7002 Series Processor 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3. Expansion slots: 1 PCI-E 4.0 x16 (LP Riser), 1 PCI-E 4.0 x16 (for AIOM) 4. AIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 6 Hot-swap 2.5" drive bays: 2 NVMe/SATA3, 4 SATA3 (optional NVMe) M.2 Interface: 4 SATA/PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 7. 3x 4cm 17.6K RPM middle fans 8. 2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load). Complete System Only: To maintain quality and integrity, this product is sold only as a completely assembled system (for optimal performance 8 DIMMs is recommended). Minimum requirement is 1 CPU, 4 DIMMs, 1 HDD/NVMe and 1 AIOM/AOC NIC card per node.
Super F2014S-RNTR, 4x Node FT,1x AMD 7002, Video,AIOM LAN, 8x HS SATA Bays,IPMI,D4(1TB),4U RM,R2200W
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Key Applications - Hyperscale / Hyperconverged - HPC and Big Data - Data Center Enterprise Applications - Scale Out Storage - Telco Data Center - Virtualization Server Key Features 4 Hot-pluggable System Nodes in a 4U form factor. Each node supports: 1. Single AMD EPYC¿ 7002 Series Processor 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3. Expansion slots: 1 PCI-E 4.0 x16 (LP Riser) 1 PCI-E 4.0 x8 (for Internal RAID AOC) 4. AIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 8 Hot-swap 3.5" drive bays: Front 6 SATA (Optional NVMe support), Rear 2 SATA/NVMe M.2 Interface: 4 SATA/PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 7. 2x 8cm 13.5K RPM middle fans 8. 2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Super F517H6-FT, 4x Nodes F I/O,E3-1200,Video,2x GB NIC,8+4 Fixed Bays,IPMI,D3(32G),4U/R1620W,80+
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Key Features Hadoop, 4-Node Front I/O Each node supports: 1. Single socket H2 (LGA 1155) supports Intel® Xeon® E3-1200 & E3-1200 v2 series, 2nd and 3rd Gen Core i3 processors***, Pentium, and Celeron 2. Up to 32GB DDR3 ECC 1333MHz / 1600MHz*** UDIMMs in 4 sockets 3. 2 (x8) PCI-E 3.0*** Low-profile slots 4. I/O ports: 2 GbE LAN, 1 Built-in video, 1 COM port onboard, 2 USB 2.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 8 Fixed 3.5" SAS/SATA HDD Bays (connected to AOC w/ LSI 2308 SAS2 ports) + 4 Fixed 3.5" SATA HDD Bays + 2 Fixed 2.5" SATA HDD Bays 7. 1620W Redundant Power Supplies Platinum Level (94%)
Super F610P2-RTN, 4xNodes, 2xLGA-4189,Video,1xAIOM,6xHS 2.5" SAS3/NVMe4,2xM.2,IPMI,D4(4TB),4U/R2200W
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Key Applications - Hyperscale / Hyperconverged - HPC and Big Data - Data Center Enterprise Applications - Telco Data Center and ETSI certified - Scale-Out Storage - Virtualization Server Key Features Eight hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: Socket P+(LGA 4189) Supports 3rd Generation Intel® Scalable Processors (Dual Socket) 16 DIMMs Supports up to 5TB Intel® Optane Persistent Memory 200 Series; up to 4TB DDR 4-3200 Network Connectivity Via AIOM (OCP 3.0 Compliant) NVMe/SATA/SAS options AIOM and M.2 support; 1 AIOM card support (PCI-E 4.0) 6 or 8 Hot Swap Drives 2.5" NVME or SAS/SATA 2 M.2 internal drives Front access node for better serviceability; 6x 2.5" hot-swap HDDs per node. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs and 4 DIMMs).
Super F617H6-FT+, 4x Nodes F I/O,2x X9/8C,Video,2x GB NIC,8+4 Fixed Bays,IPMI,D3(512G),4U/R1620W,80+
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Key Features Hadoop, 4-Node Front I/O Each node supports: 1. Intel® Xeon® processor E5-2600 family; QPI up to 8GT/s 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM sockets 3. Expansion slot: 1 PCI-E 3.0 x16 (LP) and 1 PCI-E x8 (LP) via riser card 4. I/O ports: 2 GbE ports, 1 Built-in video, 1 COM port onboard, 2 USB 2.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 8 Fixed 3.5" SAS/SATA HDD Bays + 4 Fixed 3.5" SATA HDD Bays 7. 1620W Redundant Power Supplies 80 PLUS, Platinum Level (94%)