SuperServer 6025C-UR, 2x LGA771/QC, UIO, Video, 2x GB Lan, 8x HS 3.5" SATA, DDR2/48G, 2U/700W(1+1)
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Key Features 1. Dual Intel® 64-bit Xeon® Quad-Core or Dual-Core, with 1333 / 1066 MHz FSB 3. Up to 48GB 667/533MHZ DDR2 ECC Register SDRAM 3. 1 Universal I/O (UIO) Slot, 3 (x8) Full-height/length PCI-E, 2 (x4) Low-Profile PCI-E 1 Low-Profile 64-bit 133MHz PCI-X Expansion Slots 4. Intel® 82575EB Dual-port Gigabit Ethernet Controller 5. 8 x 3.5" Hot-swap Drives Trays 6x SATA Hard Drives Supported 6. 700W High-efficiency Redundant Power Supply
SuperServer 7034L-IB, Xeon LV, FSB667MHz, Video, 4x HDD, 1x GbE Lan, DDR2(16GB), 450W
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Key Features 1. Dual Intel® Dual Core Xeon® Processor LV (Low Voltage), 667 MHz FSB 2. Up to 16GB DDR2 400 SDRAM 3. 1 (x8) PCI-Express, 2x 64-bit 66MHz PCI-X, 1x 32-bit 33MHz PCI 4. Intel® 82573V and 82573L Gigabit Ethernet Controllers 5. 1 x Drive Carrier for up to 4 Hard Disk Drives 6. 450W Power Supply
SuperServer CloudDC SYS-222C-TN, 2U UP with DC-MHS, 24 hot-swap 2.5¿ NVMe/SATA/SAS bays, 6 PCIe 5.0
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Key Applications: Networking Appliance ; Data Center Optimized, Value IaaS ; Cloud Computing ; HPC, Data Center ; Private & Hybrid Cloud ; Cloud Solution Provider (CSP) ; Key Features : Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot - Up to 2 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1 - Up to 6 front hot-swap 2.5" PCIe 5.0 NVMe drive bays
SuperServer GrandTwin SYS-212GT-DNAF, 2U 2-Node GrandTwin with front I/O and double-width GPU suppor
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Key Applications : HPC ; Deep Learning/AI/Machine Learning Development ; Scale-Out Object Storage ; Cloud Gaming ; ; MEC (Multi-Access Edge Computing) ; Multi-Purpose CDN ; Telco Edge Cloud ; IoT Edge Computing / Gateway ; Cluster Node ; GPU Virtualization (VDI) ; HPC cluster computer nodes ; Key Features : Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with P-cores up to 500W with air cooling ; 2. Up to 12x DIMMs supporting up to 3TB MRDIMM 8800 in 1DPC ; 3. Flexible networking with up to 2 PCIe 5.0 x16 FH AOC + 1 optional AIOM slot ; 4. Up to 2 PCIe 5.0 x16 FH10.5"L slots (1x double-width GPU or 2x single-width AOCs) ; 5. GrandTwin front IO module offers additional value for networking expansion(10G/25G/200G) ; 6. 2x Redundant 2200W Titanium (certification pending) Level power supplies ;
SuperServer GrandTwin SYS-212GT-HNF, 2U 4-Node with up to 8 hot-swap E1.S NVMe drives per node
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Key Applications : HPC ; Deep Learning/AI/Machine Learning Development ; Scale-Out Object Storage ; Cloud Gaming ; ; MEC (Multi-Access Edge Computing) ; Multi-Purpose CDN ; Telco Edge Cloud ; IoT Edge Computing / Gateway ; Cluster Node ; GPU Virtualization (VDI) ; HPC cluster computer nodes ; Key Features : Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Highly configurable 2U 4-Node front access nodes for cold aisle serviceability with up to 8x E1.S NVMe drives per node ; 2. 1x PCIe 5.0 x16 LP slot(offering with 4x E1.S drives), or 1 OCP3.0 slot (offering with 2x U.2 drives) for networking expansions ;
SuperServer GrandTwin SYS-212GT-HNR, 2U 4-Node GrandTwin with up to 6 hot-swap 2.5" NVMe, real I/O
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Key Applications : Scale Out All-Flash NVMe Storage ; Scale-Out Object Storage ; Web Server, Firewall Application ; Data Center Optimized, Value IaaS ; Cloud Computing, Compact Server ; Virtualization Server (VSAN) ; Network Function Virtualization ; Software Defined Storage ; General Purpose ; Multi-Purpose CDN ; Mission Critical Web Applications ; Key Features : Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Compact 2U 4-Node GrandTwin Rear IO with up to 6 hot-swap 2.5 NVMe drives and 2 OCP3.0 slots per node ; 2. Dense compute, storage and flexible networking configurations optimized for software-defined storage applications ;
SuperServer Hyper SYS-212H-TN, 2U UP supporting up to 24 hot-swap 2.5¿ NVMe/SAS/SATA bays and 8PCIe
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Key Applications : Virtualization ; Software-defined Storage ; AI Inference and Machine Learning ; Cloud Computing ; Enterprise Server ; Data Center Optimized ; Database Processing and High Density Storage ; Key Features : 1. Hyper is a flagship performance rackmount server designed for scale-out cloud workloads ; 2. Single Intel® Xeon® 6 6900 series Processor ; 3. 16 DIMM slots support RDIMM / MRDIMM(1DPC) ; 4. Double width add-on card support ; 5. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) ; 6. Breeze through high throughput workloads with PCIe 5.0 NVMe drive support ; 7. Trusted Platform Module (TPM) 2.0 onboard ; 8. Modularized and Tool-less design for easy serviceability.
SuperServer Hyper SYS-212HA-TN, 2U UP Hyper supporting up to 24 hot-swap 2.5" NVMe/SAS/SATA bays
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Key Applications : Virtualization ; Software-defined Storage ; AI Inference and Machine Learning ; Cloud Computing ; Enterprise Server ; Data Center Optimized ; Database Processing and High Density Storage ; Key Features : 1. Hyper is a flagship performance rackmount server designed for scale-out cloud workloads ; 2. Single Intel® Xeon® 6 6900 series Processor ; 3. 12x DIMM slots supporting up to 3TB of 8800 MRDIMM ; 4. Double width add-on card support ; 5. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) ; 6. Breeze through high throughput workloads with PCIe 5.0 NVMe drive support ; 7. Trusted Platform Module (TPM) 2.0 onboard ; 8. Modularized and Tool-less design for easy serviceability ;
SuperServer IoT SYS-212B-FN4TP, X14 2U Short-depth Front I/O System with 4x 10G ports, 2x 2.5" NVMe
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Key Applications 5G Core and Edge ; AI Inference and Machine Learning ; Network Function Virtualization ; Cloud Computing; Key Features: 1. Design with compliance to NEBS-Level 3 2. Single Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores ; 3. Up to 2TB ECC RDIMM DDR5-6400MT/s or up to 512GB MRDIMM DDR5-8000MT/s in 8 DIMM slots ; 4. Up to 4 PCIe 5.0 x16 (3 FHHL + 1 HHHL) &1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards ; 5. Onboard 2x 10GbE, 2X 10G SFP+ ; 6. Optional 2 front hot-swap 2.5" NVMe drive bays
SuperServer SB-623P-XiRB, 2x P4/Xeon, Video, 2x GB Lan, DDR(8GB) 2U Rackmount 400W
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SuperMicro 2U Dual Xeon 623P-XiRB, Intel E7501 chipset, 400/533FSB, 604 pins, X5DPE-G2 Motherboard, SC822I-400RC case, floppy included, 6 IDE drive bays, 400W Redudant Power Supply
SuperServer SYS-522B-WR, 2U UP WIO with 8 hot-swap 3.5¿ SAS/SATA (4 NVMe hybrid) bays and up to 5PCI
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Key Applications : Networking Appliance ; General Purpose Computing ; Web Server, Firewall Application ; Data Center Optimized ; Entry-Level System for SOHO and SMB ; Entry GPU server ; Key Features : 1. WIO systems offer flexible I/O configurations in a cost-effective architecture to deliver truly optimized systems for specific enterprise requirements ; 2. Single Intel® Xeon® 6 Processor ; 3. 8x DIMM slots supporting up to 2TB of memory ; 4. Tool-less, Top-loading riser design support up to 5x PCIe 5.0 Expansion ; 5. Native SATA drives supported, with option for up to 4x PCIe 5.0 NVMe drives or 8 SAS drives ; 6. Trusted Platform Module (TPM) 2.0 onboard.
SuperServer SYS-622B-TRT, 2U Mainstream with 6 PCIe 5.0 slots and dual 10GbE LAN
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Key Applications: Virtualization ; Enterprise Server ; Application and data serving ; Compute Intensive Applications ; Key Features: Dual Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores, up to 350W TDP (air cooled) ; 2. Up to 2TB 6400MT/s ECC DDR5 RDIMM in 16 DIMM slots ; 3. 2x RJ45 10GbE ports ; 4. Up to 2 PCIe 5.0 x8 LP + 4 PCIe 5.0 x16 LP slots ; 5. Up to 4 front hot-swap 3.5" NVMe/SAS/SATA + 4 front hot-swap 3.5" SAS/SATA drive bays ; 6. 2x Redundant 1200W Titanium Level power supplies ; 7. 2U Rackmount chassis with 25.5" (647mm) depth ;