Super 6049P-E1CR36L, 2x LGA3647, Video, 2x 10GB/X557,36xHS SAS3(3008/IT Mode),IPMI,D4(2TB),4U/R1200W
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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 36 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3008 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM cooling fans, 2 hot-swap 8cm rear exhaust PWM fans PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)
Super 6049P-E1CR45H, 2x LGA3647, Video, 1x SIOM, 45x HS SAS3(3108/HW Raid), IPMI, D4(3TB), 4U/R1600W
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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 45 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays; optional 6 NVMe bays 5. Broadcom 3108 SAS3, HW RAID 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 1600W Redundant Power Supplies Platinum Level (94%). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 24 HDDs and 1 NIC or SIOM card).
Super 6049P-E1CR45L+, 2x LGA3647, Video, 1x SIOM, 45xHS SAS3(3616/IT Mode), IPMI, D4(3TB), 4U/R1600W
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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 45 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays; optional 6 NVMe bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 1600W Redundant Power Supplies Platinum Level (94%). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 24 HDDs and 1 NIC or SIOM card).
Super 6049P-E1CR45L, 2x LGA3647, Video, 1x SIOM, 45xHS SAS3(3008/IT Mode), IPMI, D4(3TB), 4U/R1600W
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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 45 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays; optional 6 NVMe bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 1600W Redundant Power Supplies Platinum Level (94%). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 24 HDDs and 1 NIC or SIOM card).
Super 6049P-E1CR60H, 2x LGA3647, Video, 1x SIOM, 60x HS SAS3(3108/HW Raid), IPMI, D4(3TB), 4U/R2000W
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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3108 SAS3, HW RAID 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 30 HDDs and 1 NIC or SIOM card).
Super 6049P-E1CR60L+, 2x LGA3647, Video, 1x SIOM, 60xHS SAS3(3616/IT Mode), IPMI, D4(3TB), 4U/R2000W
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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%) SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 30 HDDs and 1 NIC or SIOM card).
Super 6049P-E1CR60L, 2x LGA3647, Video, 1x SIOM, 60xHS SAS3(3008/IT Mode), IPMI, D4(3TB), 4U/R2000W
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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 60 Hot-swap 3.5" SAS3/SATA3 drive bays with SES3; 2 rear Hot-swap 2.5" drive bays 5. Broadcom 3008 SAS3, IT mode 6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 7. 5 Hot-swap 8cm rear exhaust PWM fans 8. 2000W Redundant Power Supplies Titanium Level (96%) SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 30 HDDs and 1 NIC or SIOM card).
Super 6049SP-DE1CR60,2xNodes,2xLGA3647,1xExp,2x10GB/X550,60x2.5"/3.5" HS SAS3,IPMI,D4(4TB),4U/R2600W
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Key Applications - Big Data & Analytics, Data Lake - HPC and AI/ML Workloads - Telco & Cloud Service Providers - Financial Services & Healthcare Image Archives - Content Repositories - Government Data Protection Key Features 1. Dual Node Twin Architecture, 2x compute Each node controls 30 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)¿ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz¿ RDIMM/LRDIMM, Supports Intel® Optane¿ DCPMM¿¿ 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3108 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 2 DIMMs, 8 HDDs per node, and SAS controller kit).
Super 6049SP-DE1CR90,2xNodes,2xLGA3647,1xExp,2x10GB/X550,60x2.5"/3.5" HS SAS3,IPMI,D4(4TB),4U/R2600W
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Key Applications - Big Data & Analytics, Data Lake - HPC and AI/ML Workloads - Telco & Cloud Service Providers - Financial Services & Healthcare Image Archives - Content Repositories - Government Data Protection Key Features 1. Dual Node Twin Architecture, 2x compute Each node controls 45 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)¿ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz¿ RDIMM/LRDIMM, Supports Intel® Optane¿ DCPMM¿¿ 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3108 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 2 DIMMs, 15 HDDs per node, and SAS controller kit).
Super 6049SP-DE2CR60,2xNode,2xLGA3647,2xExp,2x10GB,2xS3616+60x2.5"/3.5" HS SAS3,IPMI,D4(4T),4U/R26KW
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Key Applications - Big Data & Analytics, Data Lake - HPC and AI/ML Workloads - Telco & Cloud Service Providers - Financial Services & Healthcare Image Archives - Content Repositories - Government Data Protection Key Features 1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)¿ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz¿ RDIMM/LRDIMM, Supports Intel® Optane¿ DCPMM¿¿ 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 4 CPUs, 4 DIMMs, 15 HDDs).
Super 6049SP-DE2CR90,2xNode,2xLGA3647,2xExp,2x10GB,2xS3616+90x2.5"/3.5" HS SAS3,IPMI,D4(4T),4U/R26KW
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Key Applications - Big Data & Analytics, Data Lake - HPC and AI/ML Workloads - Telco & Cloud Service Providers - Financial Services & Healthcare Image Archives - Content Repositories - Government Data Protection Key Features 1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)¿ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz¿ RDIMM/LRDIMM, Supports Intel® Optane¿ DCPMM¿¿ 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 4 CPUs, 4 DIMMs, 30 HDDs).
Super 6049SP-E1CR90,2x LGA3647, Video, 2x 10GB/X550, 90x 2.5"/3.5" HS SAS3, IPMI, D4(4TB), 4U/R2600W
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Key Applications - Big Data & Analytics, Data Lake - HPC and AI/ML Workloads - Telco & Cloud Service Providers - Financial Services & Healthcare Image Archives - Content Repositories - Government Data Protection Key Features 1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)¿ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz¿ RDIMM/LRDIMM, Supports Intel® Optane¿ DCPMM¿¿ 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3108 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 2 DIMMs, 23 HDDs, and SAS controller kit).
Super 610C-TR,2xLGA-4189,4xPCIe4.0,Video,LAN via Slim-AIOM,4xHS 3.5" SATA3 Bay,IPMI,D4(6TB),1U/R860W
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Key Applications - Web Server, Firewall Application - Data Center Optimized, Value IaaS - Cloud Computing, Compact Server - DNS & Gateway Servers, Firewall Application - CDN, Edge Nodes Key Features Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Intel® C621A Chipset 16 DIMMs up to 6TB 3DS ECC DDR4-3200: LRDIMM/RDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 FHHL; 2 PCI-E 4.0 x16 AIOM (OCP 3.0); 2 PCI-E 3.0 x2 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 4x 3.5/2.5" hot-swap SATA/SAS drive bays 6 counter-rotating 4 cm PWM fans with optimal fan speed control, 2 air shrouds 860W redundant Platinum level 100-240Vac and 200-240 Vdc power supplies. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with Minimum 2 CPUs, 4 DIMMs and 1 Storage Device HDD/HDS/M.2, and 1 NIC).NIC requirement can either be AIOM or PCIe card.
Super 610P-ACR12N4H,2xLGA-4189,Video,2x25Gb/SFP+,12xHS SAS3/S3916L+Raid,4xNVMe,IPMI,D4(4TB),1U/R800W
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Key Applications - Database Applications - Hyperscale Data Center - Object Storage - Big Data Analytics - Scale-Out Density - Hadoop & Ceph storage solutions - Scale-out NAS Key Features Up to 4TB ECC DDR4-3200: LRDIMM/RDIMM 2x 25G SFP+ Ports Onboard 12x 3.5" hot-swap SAS/SATA, 4x hot-swap EDSFF Short Bays, 2x 2.5" 7mm NVMe/Hot-Swap SATA drive bays 4x E1.S (EDSFF Short) NVMe drives RAID support via Broadcom® 3916 2x 25Gb SFP28 onboard Front LED Indicator for each drive PCI-E 4.0 x16 AIOM Support + 3 PCI-E 4.0 LP Slots
Super 610P-ACR12N4L,2xLGA-4189,Video,2x25Gb/SFP+,12xHS SAS3/S3216 HBA,4xNVMe,IPMI,D4(4TB),1U/R800W
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Key Applications - Database Applications - Hyperscale Data Center - Object Storage - Big Data Analytics - Scale-Out Density - Hadoop & Ceph storage solutions - Scale-out NAS Key Features Up to 4TB ECC DDR4-3200: LRDIMM/RDIMM 2x 25G SFP+ Ports Onboard 12x 3.5" hot-swap SAS/SATA, 4x hot-swap EDSFF Short Bays, 2x 2.5" 7mm NVMe/Hot-Swap SATA drive bays 4x E1.S (EDSFF Short) NVMe drives Host Bus Adapter via Broadcom® 3224 PCI-E 4.0 x16 AIOM Support + 3 PCI-E 4.0 LP Slots
Super 610U-TNR,2xLGA-4189,UIO,3xPCIe40,Video,LAN via Slim-AIOM,4xHS 3.5" SAS/NVMe,IPMI,D4(6TB),R12KW
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Key Applications - Virtualization - HPC - Cloud Computing - High End Enterprise Server - Software Defined Storage - Application Tier Service Provider - 5G/Telco Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane¿ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane¿ Persistent Memory 200 series 1 Internal PCI-E 4.0 x16 1 PCI-E 4.0 x16 (LP) 2 PCI-E 4.0 x16 (FH, 10.5"L) Flexible networking options 4x3.5" hot-swap hybrid NVMe/SATA/SAS drive bays 8 heavy duty fans with optimal fan speed control 1200W redundant Titanium level power supplies. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs, 1 Storage Device HDD/HDS/M.2, and 1 NIC adapter*). *NIC adapter requirement includes either 1 Ultra Riser card with integrated NIC or 1 AOC-URG4N4 Ultra Riser card with 1 standard PCI-E NIC adapter.
Super 6119P-ACR12N4L,2xLGA3647,Video,2x25GB/RJ45,12x HS SAS3/IT+4xHS NVMe Bays,IPMI,D4(3TB),1U/R800W
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Key Applications - Hyperscale Data Center - Object Storage - Big Data Analytics - Scale-Out Density - Hadoop & Ceph storage solutions - Database Applications Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)¿ 2. 16 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz¿ RDIMM/LRDIMM, Supports Intel® Optane¿ DCPMM¿¿ 3. 1 PCI-E 3.0 x16 (HBA AOM), 1 PCI-E 3.0 x16 Left riser slot, 1 PCI-E 3.0 x8 Right riser slot, 1 PCI-E 3.0 x16 (AIOM) 4. 12 Hot-swap 3.5" SAS3/SATA3 drive bays with Broadcom 3224/3216 SAS3 IT mode controller 5. 4 Hot-swap 2.5" 7mm NVMe/SATA drive bays 6. 2 M.2 NVMe/SATA up to 80mm 7. Front Panel HDD Locate LED 8. Internal Cable Arm 9. 2x 25Gb SFP28 onboard 10. 800W Redundant Power Supplies Platinum Level High-efficiency
Super 611C-TN4R,4th Gen 2xLGA-4677,4xPCIe5.0,Video,2xAIOM,4xHS 3.5" SAS3/NVMe,IPMI,D5(4TB),1U/R860W
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Key Applications Web Server, Firewall Application Data Center Optimized, Value IaaS Cloud Computing, Compact Server DNS & Gateway Servers, Firewall Application CDN, Edge Nodes Key Features Dual sockets E (LGA-4677) 4rd Gen Intel® Xeon® Scalable processors 16 DIMMs up to 4TB 3DS ECC DDR5-4800: RDIMM 2 PCIe 5.0 x16 FHHL; 2 PCIe 5.0 x16 AIOM (OCP 3.0); 2 PCIe 5.0 x4 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
Super 620BT-DNC8R,2xNodes,2xLGA-4189,Video,1xAIOM,6x HS 3.5" SAS3(3808)/NVMe4,IPMI,D4(6TB),2U/R2200W
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Key Applications - Hyperconverged Infrastructure - Scale-Out Object Storage - Back-up & Recovery Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors Intel® C621A 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane¿ Persistent Memory Slots) Up to 6TB DDR4-3200 with Intel® Optane¿ Persistent Memory 200 Series Up to 4TB ECC DDR4-3200 with RDIMM 1 Internal PCI-E 3.0 x8 for M.2 NVMe/SATA support onboard Optional M.2 NVMe Boot Controller via AOC-SMG3-2M2-B 1 PCI-E 4.0 x16 (LP) slot; 2 PCI-E 4.0 x8 (LP) slot Network connectivity via AIOM (OCP 3.0 compliant) 6 Hot-swap 3.5" drive bays 6 PCI-E 4.0 NVMe/SAS/SATA 3.5" 2 M.2 NVMe OR 2 M.2 SATA3 Dedicated cooling zones with heavy duty fans with optimal fan speed control 2 cooling fans per node, 14.9K RPM 2 air shrouds 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (for optimal performance, 16 DIMMs are recommended per node). Minimum requirement is 2 CPUs, 2 DIMMs and 1 NIC per node.
Super 620BT-DNTR,2xNodes,2xLGA-4189,Video,1xAIOM,6x HS 3.5" SATA3/NVMe4,IPMI,D4(6TB),2xM.2,2U/R2200W
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Key Applications - Hyperconverged Infrastructure - Scale-Out Object Storage - Back-up & Recovery Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors Intel® C621A 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane¿ Persistent Memory Slots) Up to 6TB DDR4-3200 with Intel® Optane¿ Persistent Memory 200 Series Up to 4TB ECC DDR4-3200 with RDIMM 1 Internal PCI-E 3.0 x8 for M.2 NVMe/SATA support onboard Optional M.2 NVMe Boot Controller via AOC-SMG3-2M2-B 1 PCI-E 4.0 x16 (LP) slot; 2 PCI-E 4.0 x8 (LP) slot Network connectivity via AIOM (OCP 3.0 compliant) 6 Hot-swap 3.5" drive bays 6 PCI-E 4.0 NVMe/SATA 3.5" 2 M.2 NVMe OR 2 M.2 SATA3 Dedicated cooling zones with heavy duty fans with optimal fan speed control 2 cooling fans per node, 14.9K RPM 2 air shrouds 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (for optimal performance, 16 DIMMs are recommended per node). Minimum requirement is 2 CPUs, 2 DIMMs and 1 NIC per node.