Super 110D-14C-FRAN8TP,Xeon D-2766NT,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5" Bay,IPMI,D4/512GB,1U/R800W
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Key Applications Intel® QuickAssist Technology Key Features Intel® Xeon® Processor D-2766NT, CPU TDP 97W Up to 256GB Registered ECC RDIMM, DDR4-2667MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2667MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCIe 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCIe 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 800 W, 100-240 Vac
Super 110D-14C-FRDN8TP,Xeon D-2775TE,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5",IPMI,D4/512GB,1U/R600W Vdc
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Key Applications Intel® QuickAssist Technology Key Features Intel® Xeon® Processor D-2766NT, CPU TDP 97W Up to 256GB Registered ECC RDIMM, DDR4-2667MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2667MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCIe 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCIe 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 600 W, -48 Vdc
Super 110D-16C-FRAN8TP,Xeon D-2775TE,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5" Bay,IPMI,D4/512GB,1U/R800W
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Key Features Intel® Xeon® Processor D-2775TE, CPU TDP 100W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 800 W, 100-240 Vac
Super 110D-16C-FRDN8TP,Xeon D-2775TE,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5",IPMI,D4/512GB,1U/R600W Vdc
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Key Features Intel® Xeon® Processor D-2775TE, CPU TDP 100W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 600 W, -48 Vdc
Super 110D-20C-FRAN8TP,Xeon D-2796NT,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5" Bay,IPMI,D4/512GB,1U/R800W
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Key Applications - Intel® QuickAssist Technology Key Features Intel® Xeon® Processor D-2796NT, CPU TDP 120W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 800 W, 100-240 Vac
Super 110D-20C-FRDN8TP,Xeon D-2796NT,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5",IPMI,D4/512GB,1U/R600W Vdc
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Key Applications - Intel® QuickAssist Technology Key Features Intel® Xeon® Processor D-2796NT, CPU TDP 120W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 600 W, -48 Vdc
Super 110D-4C-FRAN8TP,XeonD-2712T,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5"Bay,IPMI,D4/512GB,1U/R800W,Vac
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Key Features Intel® Xeon® Processor D-2712T, CPU TDP 65W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 800 W, 100-240 Vac
Super 110D-4C-FRDN8TP, Xeon D-2712T, Video,4xGB+2x25G/SFP28+2x10GB,2x2.5",IPMI,D4/512GB,1U/R600W Vdc
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Key Features Intel® Xeon® Processor D-2712T, CPU TDP 65W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 600 W, -48 Vdc
Super 110D-8C-FRAN8TP,XeonD-2733NT,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5"Bay,IPMI,D4/512G,1U/R800W,Vac
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Key Applications - Intel® QuickAssist Technology Key Features Intel® Xeon® Processor D-2733NT, CPU TDP 80W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 800 W, 100-240 Vac
Super 110D-8C-FRDN8TP, Xeon D-2733NT,Video,4xGB+2x25G/SFP28+2x10GB,2x2.5",IPMI,D4/512GB,1U/R600W Vdc
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Key Applications - Intel® QuickAssist Technology Key Features Intel® Xeon® Processor D-2733NT, CPU TDP 80W Up to 256GB Registered ECC RDIMM, DDR4-3200MHz; Up to 512GB LRDIMM LRDIMM, DDR4-3200MHz, in 4 DIMM slots 2x Internal 2.5" drive bays(2x PCI-E 4.0 NVMe x8 SlimSAS and 1x OCuLink options) 4x GbE, 2x 25G SFP28 and 2x 10G Base-T 1x M.2 M-Key 2242/2280 (SATA/PCI-E 3.0 x4) 5x 40x56mm Hot-swap Counter-rotation PWM Fans Redundant 600 W, -48 Vdc
Super 110P-FDWTR,Front IO,1xLGA4189,3xPCIe4.0,Video,2x10GB,2x2.5" Bay,1xM.2,IPMI,D4(2TB),1U/R600W/DC
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Key Applications - Multi-Access Edge Computing - Outdoor DU of 5G Application - Flex-RAN, Open-RAN vBBU Key Features Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM 2x 2.5" drive bays; 1 M.2 NVMe OR 1 M.2 SATA3 6 heavy duty fans with optimal fan speed control; 1 Air Shroud(s) 600W Redundant Power Supplies Level (92%+)
Super 110P-FRDN2T,Front IO,1xLGA4189,2xPCIe4.0,Video,2x10GB,2x2.5" Bay,1xM.2,IPMI,D4(2T),1U/R600W/DC
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Key Applications - Multi-Access Edge Computing - Flex-RAN, Open-RAN vBBU - Artificial Intelligence (AI) on Edge, Machine Learning (ML) Key Features Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors 8x DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM 2x PCI-E Gen4 x16 FHFL slot 2x 2.5" drive bays; 1x M.2 NVMe OR 1x M.2 SATA3 5x hot-swappable counter rotated fans with optimal fan speed control Redundant 600W DC Power Supplies Front-access I/O: 2x 10GBased-T, 1x Dedicated IPMI, 2x USB3.0, 2x USB2.0, 1x COM, 1x VGA
Super 110P-FRN2T,Front I/O,1xLGA4189,2xPCIe4.0,Video,2x10GB,2x2.5" Bay,1xM.2,IPMI,D4(2TB),1U/R600W,
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Key Applications - Multi-Access Edge Computing - Flex-RAN, Open-RAN vBBU - Artificial Intelligence (AI) on Edge, Machine Learning (ML) Key Features Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors 8x DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM 2x PCI-E Gen4 x16 FHFL slot 2x 2.5" drive bays; 1x M.2 NVMe OR 1x M.2 SATA3 5x hot-swappable counter rotated fans with optimal fan speed control Redundant 600W DC Power Supplies Front-access I/O: 2x 10GBased-T, 1x Dedicated IPMI, 2x USB3.0, 2x USB2.0, 1x COM, 1x VGA
Super 110P-FWTR,Front IO,1xLGA4189,WIO,3xPCIe4.0,Video,2x10GB,2x2.5" Bay,1xM.2,IPMI,D4(2TB),1U/R800W
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Key Applications Multi-Access Edge Computing Outdoor DU of 5G Application Flex-RAN, Open-RAN vBBU Key Features Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM 2x 2.5" drive bays; 1 M.2 NVMe OR 1 M.2 SATA3 6 heavy duty fans with optimal fan speed control; 1 Air Shroud(s) 800W Redundant Power Supplies Level (94%+)
Super 110P-WR,1xLGA-4189,WIO,3xPCIe4.0,Video,2xGB LAN,10xHS 2.5" SATA3 Bay,IPMI,D4(2TB),1U/R750W
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Key Applications - Virtualization - Cloud Computing - Enterprise Server - Data Center Optimized - Database Processing and Storage Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0 x16 (LP) slot Intel® Ethernet Controller X550 2x 10GbE RJ45 10x hot-swap 2.5'' SATA3 drive bays with 4 hybrid NVMe/SATA drive bays, SAS3 with additional SAS controller card; Onboard 1x NVMe/SATA M.2 Redundant Platinum 750W Power Supply
Super 110P-WTR,1xLGA-4189,WIO,3xPCIe4.0,Video,2x10GB/X550,10xHS 2.5" SATA3 Bay,IPMI,D4(2TB),1U/R750W
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Key Applications - Virtualization - Cloud Computing - Enterprise Server - Data Center Optimized - Database Processing and Storage Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0 x16 (LP) slot Intel® Ethernet Controller X550 2x 10GbE RJ45 10x hot-swap 2.5'' SATA3 drive bays with 4 hybrid NVMe/SATA drive bays, SAS3 with additional SAS controller card; Onboard 1x NVMe/SATA M.2 Redundant Platinum 750W Power Supply
Super 110T-M, Xeon E-2300, 3x PCIe4.0, Video, 2xGB/i210,8xHS 2.5" SATA3 Bays,IPMI,D4(128GB),1U/R400W
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Key Applications - Web/Hosting Application - Database Processing and Storage - Encoding Decoding Key Features Single Socket H5 (LGA-1200) supports Intel® Xeon® E-2300 series, Intel® Pentium® processors 4 DIMMs; Up to 128GB of DDR4 ECC UDIMM memory with speeds of up to 3200MHz 1 PCI-E 4.0 x16 or 2 PCI-E 4.0 x8 (FHHL); 1 Dedicated Internal HBA slot Intel® Ethernet Controller i210 2x 1GbE RJ45 8x Hot-swap 2.5" SATA3 drive bays, SAS3 w/ additional SAS controller card; Onboard 1x NVMe M.2 Default single Platinum 400W Power Supply; Optional redundant power by adding 1x Power Supply Module
Super 1113S-WN10RT, 1x AMD 7000,Video,2x 10GB/BCM57416,10x HS 2.5" U.2 NVMe,IPMI,D4(2TB),1U RM,R750W
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Key Features ¿ Virtualization ¿ Cloud Computing ¿ All Flash Storage 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   2 PCI-E 3.0 x16 (FH/HL) slots,   1 PCI-E 3.0 x16 (LP) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 10 hot-swap 2.5" U.2 NVMe drive bays,   optional 4 SATA3 drive support with   additional cables 7. 750W Redundant Power Supplies   Platinum Level (94%)   (Full redundancy based on configuration   and application load)
Super 1114CS-TNR,1xAMD 7003,2xPCIe 4,VGA,LAN via 2xAIOM,10x HS 2.5" HS Bays,IPMI,D4(4TB),1U RM,R860W
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Key Applications - Financial Services - Cloud Computing - Network Appliance - Private Cloud - Content Delivery Network (CDN) - Deep Learning Inferencing Key Features 1. Single AMD EPYC¿ 7002/7003 Series Processor 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. Expansion slots: 2 PCI-E 4.0 x16 (FHHL) slots, 2 AIOM slots for flexible networking  (One x8 AIOM slot and one x16 AIOM slot) 4. Integrated IPMI 2.0 + KVM with dedicated LAN ¿ Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5. 10 Hot-swap 2.5" SATA3 drive bays, optional 10x SAS3/NVMe support via additional SAS/NVMe kit M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 6. 2 USB 3.0 ports (rear), 1 VGA, 1 COM, ASPEED AST2600 BMC graphics 7. Tool-less Drive Trays and Tool-less Brackets 8. 860W Redundant Platinum Level Power Supplies (Full redundancy based on configuration and application load)
Super 1114S-WN10RT, 1x AMD 7002,Video,2x 10GB/BCM57416,10x HS 2.5" U.2 NVMe,IPMI,D4(4TB),1U RM,R750W
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Key Features • Virtualization • Cloud Computing • All Flash Storage 1. Single AMD EPYC¿ 7002 Series Processor 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 2 PCI-E 4.0 x16 (FHHL) slots, 1 PCI-E 4.0 x16 (LP) slot 4. Integrated IPMI 2.0 + KVM with  dedicated LAN ¿ Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 10 Hot-swap U.2 Gen4/Gen3 NVMe drive support, Optional 10 SATA3 drive support via additional cables 6. 2x 10GBase-T LAN ports via Broadcom BCM57416 Controller 7. 1 VGA, 7 USB 3.0 (4 rear, 2 front, 1 Type A) 8. 2 SuperDOM (Disk on Module) ports 9. 750W Redundant Power Supplies Platinum Level High-efficiency (Full redundancy based on configuration and application load). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with 1 CPU, minimum 8 DIMMs, 1 NVMe). Recommended configuration for best performance is at least 24 or 32 Cores per CPU.