Product Overview

Key Applications: Virtualization ; HPC ; CDN, Edge Nodes ; Cloud Computing ; Data Center Optimized ; Storage Headnode ; Key Features: 1. All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations ; Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO) ; Support DC-SCM module with OpenBMC ; 2. Single Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores ; 3. 16x DIMM slots supporting DDR5 RDIMM(2DPC/1DPC) or MRDIMM(1DPC) ; 4. Support FH DPU and single slot GPU ; 5. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) ; 6. Breeze through high throughput workloads with PCIe 5.0 NVMe drive support ; 7. Trusted Platform Module (TPM) 2.0 9672 onboard ;