Product Overview

Key Applications: Software-defined Storage ; In-Memory Computing ; Scale Out All-Flash NVMe Storage ; Data Intensive HPC ; Private & Hybrid Cloud ; NVMe Over Fabrics Solution ; AI/Deep Learning Training and Inference ; Key Features: 1. Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors ; Support CPU TDP up to 350W with air cooling ; 2. Up to 32 DIMMs supporting up to 8TB DDR5-6400 in 2DPC ; 3. Flexible networking with up to 2 OCP 3.0 compatible AIOM slots ; 4. Up to 2 PCIe 5.0 x16 FHHL + 1 PCIe 5.0 x8 FHHL + 2x PCIe 5.0 x16 AIOM slots ; 5. Up to 32x front hot-swap E3.S 1T NVMe drive bays ; Up to 8x CXL 2.0 x8 Type 3 devices ; 6. Up to 2x double-width GPUs (Max TDP 300W) ;