Product Overview

Key Applications: Software-defined Storage ; In-Memory Computing ; Scale Out All-Flash NVMe Storage ; Data Intensive HPC ; Private & Hybrid Cloud ; NVMe Over Fabrics Solution ; Enhanced Graphics&AI ; Generative AI ; Key Features: 1. Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with P-cores Support CPU TDP up to 270W with air cooling ; 2. Supports up to 4 TB of ECC DDR5 RDIMM/RDIMM 3DS/MRDIMM memory with speeds of up to 6400 MT/s (1DPC) or up to 5200 MT/s (2DPC) in 32 DIMM slots ; 3. Flexible networking with up to 2 OCP 3.0 compatible AIOM slots ; 4. Up to 2 PCIe 5.0 x16 FHHL + 2 PCIe 5.0 x16 AIOM slots ; 5. Up to 16 front hot-swap E3.S 1T NVMe drive bays ;