Super 821GE-TNHR,4th Gen 2xLGA-4677,8+2x PCIe5.0,Video,12xHS 2.5" NVMe,IPMI,D5(8TB),8U/4xR3000W
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Key Applications High Performance Computing AI/Deep Learning Training Industrial Automation, Retail Healthcare Conversational AI Business Intelligence & Analytics Drug Discovery Climate and Weather Modeling Finance & Economics Key Features 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHFL Slots Flexible networking options 12x 2.5" Hot-swap NVMe drive bays 2 M.2 NVMe for boot drive only
Super 927R-E2CJB, 2x Nodes SBB JBOD, 24x HS 2.5" SAS3(12Gbps) via AOM-SAS3-937EL-JB, IPMI, 2U/R1200W
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Key Features Two hot-pluggable systems (nodes) in a 2U form factor. 1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 2.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 8x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified
Super 937R-E2CJB, 2x Nodes SBB JBOD, 16x HS 3.5" SAS3(12Gbps) via AOM-SAS3-937EL-JB, IPMI, 3U/R1200W
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Key Features Two hot-pluggable systems (nodes) in a 3U form factor. 1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 16 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 12x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified
Super 937R-E2JB, 2x Nodes Redundant JBOD with LSI SAS2 Expander,16x HS SATA/SAS2 Bays, 720W(1+1)
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Key Features Two hot-pluggable systems (nodes) in a 3U form factor. 1. Modular Design: Redundant Hot-swap SAS2 expander modules, support dual paths to all drives in the system, and provide rapid field replacement 2. Dual SAS2 ports per IOM (one-in one-out) x4 SAS connectivity offers up to 24Gb/s bandwidth 3. 16x Hot-swap 3.5" SAS2 drive bays, support SAS as well as SATA with Interposer card (simultaneously) 4. 720W Redundant Power Supplies Gold Level Certified
Super 947R-E2CJB, 2x Nodes SBB JBOD, 24x HS 3.5" SAS3(12Gbps) via AOM-SAS3-937EL-JB, IPMI, 3U/R1200W
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Key Features Two hot-pluggable systems (nodes) in a 4U form factor. 1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 4x 40mm and 4x 80mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified
Super A+ Server AS -1116CS-TN, 1U UP CloudDC with DC-MHS, up to 12 hot-swap 2.5" NVMe/SAS/SATA bays
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Key Application: Virtualization ; HPC ; CDN, Edge Nodes ; Cloud Computing ; Data Center Optimized ; Storage Headnode ; Key Features: 1. Single 4th Generation AMD EPYC¿ 9004 Series Processors. 12x DIMM slots up to 3TB 3DS ECC RDIMM DDR5-4800MHz 2x PCI-E 5.0 x16 FHHL Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 10x 2.5" hot-swap hybrid NVMe/SATA/SAS drive bays. 860W redundant Platinum level 100-240Vac and 200-240 Vdc power suppliesAll-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations. Based on Modular DeNsity Optimized HPM Form Factor (M-DNO) ; 2. Support DC-SCM module with OpenBMC Single AMD EPYC¿ 9005/9004 Series Processor ; 3. Support up to DDR5 12 DIMM slots (1DPC), speed up to 6400MT/s (Please check System Memory Section for detail) ; 4. 2x PCIe 5.0 x16 FHHL slots ; 5. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) 1x RJ45 1 GbE Dedicated BMC LAN Port (DC-SCM) ; 6. 8x Hot-swap 2.5" NVMe/SATA/SAS drive bays Optional 4 Hot-swap 2.5" NVMe/SAS/SATA drive bays Optional RAID support via storage add-on card ; 7. Support up to 2 FHHL GPU accelerator cards ; 8. Dual 1000W / 2000W Redundant Titanium Level power supplies (Power supply full redundancy based on configuration and application load) ;
Super A+ Server AS -1126HS-TN, 1U Hyper with up to 12 hot-swap 2.5" NVMe/SAS/SATA bays and 3 PCIe 5
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Key Applications: Virtualization ; Software-defined Storage ; AI Inference and Machine Learning ; Cloud Computing ; Enterprise Server ; High Performance Computing (HPC) ; Key Features : 1. Dual AMD EPYC¿ 9005/9004 Series Processors 2. Support up to DDR5 24 DIMM slots (1DPC), speed up to 6400MT/s (Please check System Memory Section for detail). ; 3. 2x PCIe 5.0 x16 FHFL slots. 1x PCIe 5.0 x16 FHHL slot ; 4. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) ; 5. 8x Hot-swap 2.5" NVMe/SATA drive bays Optional 4 Hot-swap 2.5" NVMe/SATA drive support via additional parts. 2x M.2 PCIe 3.0 NVMe slots ; 6. Dual 1600W / 2000W / 2600W Redundant Titanium Level power supplies (Power supply full redundancy based on configuration and application load);
Super ARS-211GL-NR,2x nVidia Grace,VGA,7xPCIe5x16,AOC via LAN,8xHS E1.S NVMe Bays,DR5X(480G),2U R2KW
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Key Applications High Performance Computing AI/Deep Learning Training Large Language Model (LLM) Natural Language Processing General purpose CPU workloads, including analytics, data science, simulation, HPC, application servers, and more Key Features High density 2U GPU system with up to 4 NVIDIA® H100 PCIe GPUs Highest GPU communication using NVIDIA® NVLINK¿ PCIe-based H100 NVL with NVLink Support Energy-Efficient NVIDIA Grace¿ CPU Superchip with 144 Cores. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum on Grace Superchip Module, Min of 240GB Memory, 2 GPUs, 1 Storage device, and 1 NIC or either Cx7 or Bluefielw 3). Service: OSNBD3 is hightly recommended.
Super AS-3015MR-H8TNR,8x Nodes/AMD AM5,Video,I/O Hub,2x HS 2.5" or 3.5" Bays,IPMI,D5/128GB,3U/R2200W
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Key Applications Cloud Computing Web/Collocation Services Web Cache, CDN, Video Streaming Social Networking, Downloads Corporate - WINS, DNS, Print, Login Key Features 8 set of AMD Ryzen (Zen4) CPU, AM5 Socket, LGA-1718. AMD Knoll - Integrated I/O Controller Hub 8 set of Up to 128GB ECC/non ECC UDIMM; DDR5 5200MHz, in 4 DIMM sockets 8 set of PCIe 5.0 x8 (in x16 slot) low profile slot and 8 set of Micro-LP slots (MicroLP upgradable) 8 set of 2x Front Hot-swappable 3.5" SATA3 HDD or Hybrid 2x 2.5" SAS/SATA3/NVMe U.2 drives w/ option kits 2200W Redundant 80+ Titanium Level high-efficiency power supplies
Super AS-4021GA-62R+F, 2x Opt/6C, 4x GPU Slots,Video,2x GB Lan,8x HS SAS2,DDR2(128GB), 4U RM, R1400W
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Key Features 1. Two Six-Core / Quad-Core AMD Opteron¿ 2000 Series (Socket F) support; HT3.0 Link support 2. Dual AMD SR5690 + SP5100 Chipset PCI-E Gen2 support 3. Up to 128GB Registered ECC DDR2 800/667/533 SDRAM in 16 DIMM 4. Intel® 82576 controllers, Dual-Port GbE 5. Up to Four GPU cards 6. 4x PCI-e 2.0 x16, 2x PCI-e 2.0 x4 (in x8 slot), and 1x PCI slot 7. LSI 2008 8 port SAS2 controller, RAID 0, 1, 10; RAID 5 Optional 8. 8x 3.5" Hot-swap SATA Drive Bays, 3x 5.25" Drive Bays 9. Integrated Matrox G200eW 16MB Graphics 10. IPMI 2.0 with Dedicated LAN support 11. High-efficiency 1400W Redundant Power Supplies (80 Plus Gold)
Super AS-4021M-32R, 2x Opt/QC, 2x PCI-e(x8), Video, 2x GB Lan, 8x HS SAS, DDR2(64GB), 4U RM, R800W
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Key Features 1. Two Quad-Core / Dual-Core AMD Opteron¿ 2000 Series (Socket F) Support, 1000 MHz HyperTransport Link 2. nVidia MCP55 Pro / AMD 8132 Chipset 3. 8 x 3.5" Hot-swap SAS / SATA Drive Bays 4. Up to 64GB DDR2 800/667/533 SDRAM 5. 2 (x8) PCI-e, 1 (x4) PCI-e (in x8 slot), 1 64-bit 133MHz PCI-X, 2 64-bit 133/100MHz PCI-X 6. Dual-port Gigabit LAN/Ethernet Controller 7. 800W Redundant Power Supply
Super AS-4021M-82R+, 2x Opt/QC, 2x PCI-e(x8), Video, 2x GB Lan, 8x HS SCSI, DDR2(128GB), 4U RM,R800W
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Key Features 1. Two Quad-Core / Dual-Core AMD Opteron¿ 2000 Series (Socket F) Support, 1000 MHz HyperTransport Link 2. Up to 128GB DDR2 800/667/533 SDRAM; 16 DIMM Sockets 3. 2 x8 PCI-e, 2 64-bit 133/100MHz PCI-X, 2 64-bit 100MHz PCI-X 4. nVidia MCP55 Pro / NEC uPD720400 Chipset 5. 8x 3.5" Hot-swap U320 SCSI Drive Bays 6. Dual-port Gigabit LAN/Ethernet Controller 7. 800W Redundant Power Supply
Super AS-4021M-T2R+, 2x Opt/QC, 2x PCI-e(x8), Video, 2x GB Lan, 8x HS SATA, DDR2(128GB), 4U RM,R800W
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Key Features 1. Two Quad-Core / Dual-Core AMD Opteron¿ 2000 Series (Socket F) Support, 1000 MHz HyperTransport Link 2. Up to 128GB DDR2 800/667/533 SDRAM; 16 DIMM Sockets 3. 2 x8 PCI-e, 2 64-bit 133/100MHz PCI-X, 2 64-bit 100MHz PCI-X 4. nVidia MCP55 Pro / NEC uPD720400 Chipset 5. 8 x 3.5" Hot-swap SATA Drive Bays 6. Dual-port Gigabit LAN/Ethernet Controller 7. 800W Redundant Power Supply
Super ASG-1014S-ACR12N4H,1xEPYC7003,3xPCIe4,Video,2x10GB,12x3.5"+4x2.5" HS,IPMI,D4(4TB),1U RM,R800W
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Key Applications - Database Applications - Hyperscale Data Center - Object Storage - Big Data Analytics - Scale-Out Density - Hadoop & Ceph storage solutions - Scale-out NAS Key Features Single AMD EPYC¿ 7003/7002 Series Processor (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 16 DIMMs; Up to 4TB 3DS ECC Registered DDR4-3200MHz RDIMM/LRDIMM 2 PCI-E 4.0 x16 (FHHL) Slots, 1 PCI-E 4.0 x16 (LP) Slot 2x 10GBase-T LAN Ports via Broadcom BCM57416 Controller 12x 3.5" SAS3/SATA3 Hot-Swap Drive Bays, 4x 2.5" 7mm U.2 NVMe Hot-Swap Drive Bays 800W Redundant Power Supplies Platinum Level High-efficiency (Full redundancy based on configuration and application load.) RAID support via Broadcom® 3916
Super ASG-1115S-NE316R, 1xEPYC/9004,VGA,2xPCIe 5.0+2xAIOM,16x E3.S HS NVMe,IPMI,D4(6TB),1U RM,R1600W
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Key Features Single Socket SP5 4th Generation AMD EPYC 9004 Scalable processors. Up to 300W TDP. Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 16x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 1600W Power Supplies
Super ASG-2115S-NE332R,1xEPYC/9004,VGA,2xPCIe 5.0+2xAIOM,32x E3.S HS NVMe,IPMI,D4(6TB),2U RM,R2000W
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Key Applications Software-defined Storage In-Memory Computing Data Intensive HPC Private & Hybrid Cloud NVMe Over Fabrics Solution Key Features Single Socket SP5 AMD EPYC¿ 9004 Series processors. Up to 350W TDP. Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 32x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 2000W Power Supplies
Super BigTwin SYS-222BT-HER, 2U 4-Node BigTwin with 8 hot-swap E3.S 1T NVMe drives per node
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Key Applications - All-Flash NVMe Hyperconverged Infrastructure - Container-as-a-Service; Application Accelerator - High-Performance File System - Diskless HPC Clusters Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: - Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling - Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC - Flexible networking with OCP 3.0 AIOM slot - Up to 2 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1 - Up to 6 front hot-swap 2.5" PCIe 5.0 NVMe drive bays
Super E100-12T-C, Intel 6305E(15W),U Video,HD Audio,HDMi,2x2.5GB,M.2,4xCOM,D3(64GB)SD,IoT,12V DC/84W
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Key Applications - Industrial Automation, Retail - Smart Medical Expert Systems - Kiosk, Interactive info system - IoT Gateway for Smart Factory - Smart Building - Security and Surveillance - Digital Signage Key Features 1. Intel® Celeron® 6305E Processor; Single Socket FCBGA-1449 2. System-on-Chip 3. M.2: B-Key, M-Key, E-Key M.2 2242/3042/2280 B-Key (USB3.0/2.0, SATA Gen3/PCI-E Gen3 x1) with nano SIM holder M.2 2230 E-Key (CNVi/PCI-E 3.0 x1/USB2) M.2 2242/2280 M-Key (PCI-E 4.0 x4), NVMe support 4. Up to 64GB Unbuffered Non-ECC SO-DIMM DDR4 3200MHz; 2 DIMM slots 5. Dual 2.5GbE LAN w/ Intel I225-IT 6. 4 COM (RS-232/422/485), 3 USB 3.2, 1 USB-C 3.2, 4 USB 2.0, 1 DIO via DB9 7. 1 HDMI 2.0b (4K60Hz), 1 HDMI 1.4b 8. 0°C to 50°C Operating Temperature 9. Lockable 12V DC 84W power adapter 10. Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super E100-12T-E,Intel i5-1145GRE, U Video,HD Audio,HDMi,2x2.5GB,M.2,4xCOM,D3(64GB)SD,IoT,12V DC/84W
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Key Applications - Industrial Automation, Retail - Smart Medical Expert Systems - Kiosk, Interactive info system - IoT Gateway for Smart Factory - Smart Building - Security and Surveillance - Digital Signage Key Features 1. 11th Generation Intel® Core¿ i5-1145GRE Processor; Single Socket FCBGA-1449 2. System-on-Chip 3. M.2: B-Key, M-Key, E-Key M.2 2242/3042/2280 B-Key (USB3.0/2.0, SATA Gen3/PCI-E Gen3 x1) with nano SIM holder M.2 2230 E-Key (CNVi/PCI-E 3.0 x1/USB2) M.2 2242/2280 M-Key (PCI-E 4.0 x4), NVMe support 4. Up to 64GB Unbuffered Non-ECC SO-DIMM DDR4 3200MHz; 2 DIMM slots 5. Dual 2.5GbE LAN w/ Intel I225-IT 6. 4 COM (RS-232/422/485), 3 USB 3.2, 1 USB-C 3.2, 4 USB 2.0, 1 DIO via DB9 7. 1 HDMI 2.0b (4K60Hz), 1 HDMI 1.4b 8. -30°C to 50°C Operating Temperature 9. Lockable 12V DC 84W power adapter 10. Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super E100-12T-H,Intel i7-1185GRE,XeVideo,HD Audio,HDMi,2x2.5GB,M.2,4xCOM,D3(64GB)SD,IoT,12V DC/84W
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Key Applications - Industrial Automation, Retail - Smart Medical Expert Systems - Kiosk, Interactive info system - IoT Gateway for Smart Factory - Smart Building - Security and Surveillance - Digital Signage Key Features 1. 11th Generation Intel® Core¿ i7-1185GRE Processor; Single Socket FCBGA-1449 2. System-on-Chip 3. M.2: B-Key, M-Key, E-Key M.2 2242/3042/2280 B-Key (USB3.0/2.0, SATA Gen3/PCI-E Gen3 x1) with nano SIM holder M.2 2230 E-Key (CNVi/PCI-E 3.0 x1/USB2) M.2 2242/2280 M-Key (PCI-E 4.0 x4), NVMe support (add MCP-270-10105-0B Fin Bottom Cover) 4. Up to 64GB Unbuffered Non-ECC SO-DIMM DDR4 3200MHz; 2 DIMM slots 5. Dual 2.5GbE LAN w/ Intel I225-IT 6. 4 COM (RS-232/422/485), 3 USB 3.2, 1 USB-C 3.2, 4 USB 2.0, 1 DIO via DB9 7. 1 HDMI 2.0b (4K60Hz), 1 HDMI 1.4b 8. -30°C to 50°C Operating Temperature 9. Lockable 12V DC 84W power adapter 10. Hailo-8¿ powerful and efficient Edge AI solution integration ready