Super 2114S-WN24RT,1x AMD 7002,Video,2x 10GB/BCM57416,24x HS 2.5" U.2 NVMe,IPMI,D4(4TB),2U RM,R1200W
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Key Features ¿ Virtualization ¿ Hyperconverged Storage ¿ Cloud Computing ¿ All Flash Storage 1. Single AMD EPYC¿ 7002-Series Processor 2. Up to 4TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)   (Full redundancy based on configuration   and application load). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with 1 CPU, minimum 4 DIMMs, at least 1 NVMe). Recommended configuration for best performance is at least 1 DIMM per channel (8 DIMM Total). Please contact your sales rep for special requirements. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with 1 CPU, minimum 8 DIMMs, 1 NVMe). Recommended configuration for best performance is at least 24 or 32 Cores per CPU.
Super 2115GT-HNTF,4xNodes,1xAMD 9004,Video,AIOM/OCP3.0,4xHS 2.5" NVMe Bays,IPMI,D4(3TB),2U RM,R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, AMD EPYC¿ 9004 Series Processors up to 360W TDP 12 DIMM Slots , up to 3TB DDR5 memory Flexible bays for either Storage or AIOM / OCP 3.0 slots Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE Up to 4 Hot-swap 2.5" NVMe/SATA drives
Super 2115GT-HNTR,4xNodes,1xAMD 9004,Video,2xAIOM/OCP3,6xHS 2.5" NVMe Bays,IPMI,D4(3TB),2U RM,R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, AMD EPYC¿ 9004 Series Processors up to 290W TDP 12 DIMM Slots , up to 3TB DDR5 memory 2 AIOM / OCP 3.0 slots up to 6 Hot-swap 2.5"NVMe/SATA drives
Super 211E-FRDN13P,1xLGA-4677,2xPCIe5.0,Video,12x25Gb/SPF28,2x2.5" SATA+Raid,IPM,D5(2TB),2U/R600W,DC
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Key Applications Network Function Virtualization Cloud Computing 5G CU/DU Edge Server Flex RAN, Open RAN vBBU Key Features Design with compliance to NEBS-Level 3 DPLL/OCXO design, Up to 8 hours hold-over IEEE1588 v2 & Synchronous Ethernet support Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors 8 DIMM slots, Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM/LRDIMM 2x PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 12x 25GbE SFP28 ports 2x 2.5" drive bays for SSD drives
Super 211E-FRDN2T,1xLGA-4677,4xPCIe5.0,Video,2x10GB LAN,2x Int 2.5" NVMe,IPM,D5(2TB),2U/R600W,DC-48V
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Key Applications 5G Core and Edge AI Inference and Machine Learning Network Function Virtualization Cloud Computing Key Features Design with compliance to NEBS-Level 3 Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 2x 10GbE ports 2x 2.5" drive bays for NVMe drives 2x 600W DC -48V Power Supplies Ultra short depth, 2U Front I/O Edge Server
Super 211E-FRN13P,1xLGA-4677,2xPCIe5.0,Video,12x25Gb/SPF28,2x2.5" SATA+Raid,IPM,D5(2TB),2U/R800W
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Key Applications Network Function Virtualization Cloud Computing 5G CU/DU Edge Server Flex RAN, Open RAN vBBU Key Features Design with compliance to NEBS-Level 3 DPLL/OCXO design, Up to 8 hours hold-over IEEE1588 v2 & Synchronous Ethernet support Single Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors 8 DIMM slots, Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM/LRDIMM 2x PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 12x 25GbE SFP28 ports 2x 2.5" drive bays for SSD drives
Super 211E-FRN2T,1xLGA-4677,4x PCIe5.0,Video,2x10GB LAN,2x Int 2.5" NVMe,M.2,IPM,D5(2TB),2U/R600W,AC
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Key Applications 5G Core and Edge AI Inference and Machine Learning Network Function Virtualization Cloud Computing Key Features Design with compliance to NEBS-Level 3 Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 2x 10GbE ports 2x 2.5" drive bays for NVMe drives Redundant 800W AC Power Supplies Ultra short depth, 2U Front I/O Edge Server
Super 211GT-HNC8F,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 350W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNC8R,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 300W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) 2 AIOM 6x NVMe/SAS/SATA drive bays
Super 211GT-HNTF,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 350W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNTR,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 300W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) 2 AIOM Up to 6 Hot-swap 2.5" NVMe/SATA drives
Super 211SE-31A,3x Nodes, 4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U/F R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31AS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31D,3x Nodes,4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211SE-31DS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211TP-HPTR,4xNodes,1xLGA-4677,Video,2x10Gb/SFP+/X710,6xHS 2.5" SATA,2xM.2,IPMI,D4(2TB),2U/R2KW
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors (per node) Intel® C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 211TP-HPTRD,4xNode,1xLGA-4677,Video,2x10G/SFP+/X710,6xHS 2.5" SATA,M.2,IPMI,D4(2TB),2U/R2KW,DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors (per node) Intel® C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 2122TC-DL6RF4,2xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2008/IT),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 2 (x8) PCI-E 2.0 (in x16, low-profile) 4. Intel® I350 (Powerville) Quad Gigabit Ethernet LAN controller 5. 12x 2.5" Hot-swap SAS2/SATA/SSD HDDs (24 total) 6. LSI 6Gbps SAS 2008 IT Mode 7. 1280W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency) 8. IPMI 2.0 with dedicated LAN
Super 2122TC-H6RF4,4xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2108/HWR),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Quad-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency)
Super 2122TG-H6RF, 4x Nodes, 2x 6300/16C, Video,2x GB Lan,6x HS 2.5" SAS2,IPMI,D3/256G,2U,R1620W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 256GB DDR3 1866MHz ECC Registered DIMMs; 8x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platium Level Redundant Power Supplies (94% Efficiency)