Super E300-9D-8CN8TP,D-2146NT-2.3Ghz/8C/16T,VGA,4xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Mini 1U,60W/84W DC
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Key Features ¿ Network Security Appliance ¿ Universal Customer Premise Equipment (uCPE) ¿ Software Defined WAN (SD-WAN) ¿ NFV Edge Computing Server ¿ Virtualization Server ¿ IoT Edge Computing / Gateway 1. Intel® Xeon® processor D-2146NT, 8-Core, 16 Threads, 80W 2. System on Chip 3. 1 Fixed 2.5" drive bay with bracket 4. 1 M.2 slot M key for SSD, 2242/8, 1 M.2 B Key for SSD/ WAN card, 1 Mini-PCI-E with mSATA Support, 1 PCI-E 3.0 x8 slot 5. Up to 512GB ECC LRDIMM, up to 256GB ECC/non-ECC RDIMM DDR4-2666Mz; in 4 DIMM slots 6. 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0 7. 1 VGA, 2 USB 3.0 8. 3x 40x28mm 4-PIN PWM Fan 9. Low-noise DC Power Supply 10. Built in Intel QAT up to 40Gbps Crypto/Compression
Super E300-9S, i7-7600U, VGA, 2x GB LAN,4x COM, 1x M.2/1x Mini-PCIe,SO-DIMM D4(32GB),3.5" SBC,60W DC
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Key Features - IoT Gateway for Smart Factory/Building/Home - Kiosk, Interactive info system - Environmental Monitor 1. 7th Generation Intel® Core¿ i7-7600U Processor; Single Socket FCBGA 1356 2. System-on-Chip 3. 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E 4. Up to 32GB Unbuffered Non-ECC SO-DIMM DDR4 2133MHz; 2 DIMM slots 5. Dual GbE LAN w/ Intel i219LM + i210IT 6. 4 COM (RS-232/422/485), 2 USB 3.0, 4 USB 2.0, 1 DIO via DB9 7. 1 Display Port, 1 HDMI port 8. Fanless design 9. Lockable 12V DC 60W power adapter
Super E301-9D-8CN8TP,D-2146NT/8C/16T,VGA,4xGB+2x10GB+2x10GB/SFP+,4x7mm SSD,M.2,D4/256G,Compact 1U,DC
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Key Features • SDN-WAN, vCPE controller box • NFV Edge Computing Server • Virtualization Server • FireWall Applications • IoT Edge Computing 1. Intel® Xeon® processor D-2146NT, 8-Core, 16 Threads, 80W 2. System on Chip 3. 4x 7mm SSD 4. 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card, 1 Mini-PCI-E with mSATA Support, 1 PCI-E 3.0 x8 slot 5. Up to 512GB ECC LRDIMM, up to 256GB ECC/non-ECC RDIMM DDR4-2666Mz; in 4 DIMM slots 6. 4x 1GbE, 2x 10GBase-T, 2x 10G SFP+ and 1 dedicated LAN for IPMI 2.0 7. 1 VGA, 2 USB 3.0 8. 3x 40x28mm 4-PIN PWM Fan 9. DC Power adapter 10. Built in Intel QAT up to 40Gbps Crypto/Compression
Super E302-12A-4C, Atom C5315/4C/8T,VGA,4xGB+2x10GB/SFP+,1x 2.5" Bays,M.2,D4/128GB,Compact 1U,150W
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Key Applications IoT Gateway Network Security Appliance SD WAN Embedded Networking Applications Retail Industrial Automantion Artificial Intelligence Machine Learning Key Features Optional Wall Mount Bracket Intel® Atom® Parker Ridge processor C5315, TDP 38W Single Socket FCBGA-2106 supported System on Chip Up to 128GB ECC RDIMM DDR4-2400MHz, in 2 DIMM slots 1x M.2 B-Key 3052 w/PCIe 3.0 & SATA3 & USB3.0
Super E302-12A-8C, Atom C5325/8C/16T,VGA,4xGB+2x10GB/SFP+,1x 2.5" Bays,M.2,D4/128GB,Compact 1U,150W
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Key Applications IoT Gateway Network Security Appliance SD WAN Embedded Networking Applications Retail Industrial Automantion Artificial Intelligence Machine Learning Key Features Optional Wall Mount Bracket Intel® Atom® Parker Ridge processor C5325, TDP 41W Single Socket FCBGA-2106 supported System on Chip Up to 128GB ECC RDIMM DDR4-2933MHz, in 2 DIMM slots 1x M.2 B-Key 3052 w/PCIe 3.0 & SATA3 & USB3.0
Super E403-12P-FN2T, 1x LGA-4189, 3x PCIe4.0,VGA,2x 10GB LAN,4x 2.5" SATA3+R,M.2,IPMI,Box PC/600W
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Key Applications Multi-Access Edge Computing (MEC) Universal Customer Premise Equipment (uCPE) Network Function Virtualization (NFV) Artificial Intelligence (AI) on Edge, Machine Learning (ML) Industrial Automation, Retail, Smart Medical Expert Systems Key Features Single Socket Intel® Xeon-SP (Ice Lake) up to 32 Cores 3x PCIe4.0 x16 slot 2x 10 Gigabit Ethernet Ports 4x 2.5" Internal Drive Bays 4x USB 3.0, 2x USB 2.0
Super E403-9D-12C-FN13TP,D-2163iT-2.1Ghz/12C/24T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
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Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2163IT Processor, 12 Cores, 24 Threads, 2.1 GHz, 75W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2133Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9D-14C-FN13TP,D-2173iT-1.7Ghz/14C/28T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
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Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2173IT Processor, 14 Cores, 28 Threads, 1.7 GHz, 70W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2133Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9D-14CN-FN13TP,D-2177NT-1.9Ghz/14C/28T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,600W
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Key Features • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2177NT Processor, 14 Cores, 28 Threads, 1.9 GHz, 105W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2666Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 2242/3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W Multi-output Gold Level Power Supply
Super E403-9D-14CN-FRDN13+,D-2177NT-1.9Ghz/14C/28T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,600W DC
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2177NT Processor, 14 Cores, 28 Threads, 1.9 GHz, 105W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W -48V DC input Redundant Power Supplies
Super E403-9D-14CN-FRN13+,D-2177NT-1.9Ghz/14C/28T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,R800W
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2177NT Processor, 14 Cores, 28 Threads, 1.9 GHz, 105W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 800W Redundant Power Supplies Platinum Level Certified
Super E403-9D-16C-FN13TP,D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
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Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9D-16C-FRDN13+,D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,600W DC
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W -48V DC input Redundant Power Supplies
Super E403-9D-16C-FRN13+,D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,R800W
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Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 800W Redundant Power Supplies Platinum Level Certified
Super E403-9D-16C-IP, Xeon D-2183iT-2.2Ghz/16C/32T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Rack2U/600W
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Key Applications • 5G Radio Access Network (RAN) • Multi-Access Edge Computing (MEC) • Edge AI Inferencing • Vehicle to Everything (C-V2X/V2X) • Virtualized Functions and Services Key Features 1. Intel® Xeon® D-2183IT Processor, 16 Cores, 32 Threads, 2.2 GHz, 100W 2. Operating Temperature -40°C ~ 46°C + Solar load (-40°F ~ 114.8°F + Solar load) 3. GR-487-CORE compliant 4. Tamperproof design 5. Noise 71 dBA 6. 100-240 Vac, Est. Max Power consumption: 1200W (instantaneous)/ 900W (stable) 7. 620W heater (Initiating power: 900W)
Super E403-9D-4C-FN13TP,D-2123iT-2.2Ghz/4C/8T,VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
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Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9D-4C-FRDN13+,D-2123iT-2.2Ghz/4C/8T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,600W DC
Starting atContact Sales
Key Applications • Multi-Access Edge Computing (MEC) • Universal Customer Premise Equipment (uCPE) • Network Function Virtualization (NFV) • Edge Computing, Vehicle to Everything Application (C-V2X / V2X) Key Features 1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W -48V DC input Redundant Power Supplies
Super E403-9D-4C-FRN13+,D-2123iT-2.2Ghz/4C/8T,VGA,9xGB & 4x10G/SFP+,4x2.5",IPMI,Box PC,R800W
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Key Features 1. Intel® Xeon® D-2123IT Processor, 4 Cores, 8 Threads, 2.2 GHz, 60W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 4x 10G SFP+, 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 600W -48V DC input Redundant Power Supplies
Super E403-9D-8CN-FN13TP,D-2146NT-2.3Ghz/8C/16T, VGA,9xGB & 2x10G/RJ45+2x10G/SFP+,IPMI,Box PC,500W
Starting atContact Sales
Key Features ¿ Multi-Access Edge Computing (MEC) ¿ Universal Customer Premise Equipment (uCPE) ¿ Network Function Virtualization (NFV) ¿ Edge Computing, Vehicle to Everything Application (C-V2X / V2X) 1. Intel® Xeon® D-2146NT Processor, 8 Cores, 16 Threads, 2.3 GHz, 80W 2. Up to 512GB ECC LRDIMM, up to 256GB reg. ECC RDIMM DDR4-2400Mz; in 4 DIMM slots 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110, 1 E-Key 2230, 1 B-Key, 3042 6. 9 GbE (one for Ethernet management), 2x 10GbE, 2x 10G SFP+, and 1 Dedicated IPMI LAN port 7. 2 USB 3.0, 2 USB 2.0, 1 COM via RJ45, VGA via BMC 8. 500W Multi-output Platinum Level Power Supply
Super E403-9P-FN2T,1x LGA3647,WIO(3xPCIe),VGA, 2x10G/X722+X557,4x Int 2.5" Bays+M.2,IPMI,Box PC,600W
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Key Features Multi-Access Edge Computing (MEC) Universal Customer Premise Equipment (uCPE) Network Function Virtualization (NFV) Artificial Intelligence (AI) on Edge, Machine Learning (ML) Industrial Automation, Retail, Smart Medical Expert Systems 1. Single Socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processor (Cascade Lake-SP)¿ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 or 2 PCI-E 3.0 x8 + 1 PCI-E 3.0 x16 (FH3/4L) slots¿ 4. 4 Internal 2.5" drive bays 5. M.2: 1 M-Key 2280/22110 PCI-E 3.0 x4 and SATA 6. 2x 10GBase-T ports with Intel X722 + X557 7. 1 VGA, 1 COM, 4 USB 3.0, 2 USB 2.0 8. 600W Multi-output Gold Level Power Supply