2U Rackmount

Super 6029BT-DNC0R,2xNodes,2xLGA3657,Video,1xSIOM,6 or 3+3 HS NVMe/SAS3(3008),IPMI,D4(3TB),2U/R2200W

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Key Features - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS L/RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x8 slot, 1 PCI-E 3.0 x16, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 SAS3 or 3 NVMe + 3 SAS3 Hot-swap 3.5" drive bays, 2 internal M.2 NVMe/SATA slots 5. SAS3 support via Broadcom 3008; IT mode 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2500 BMC 8. 4 Heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level (96%). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 1 HDD/NVMe and 1 SIOM card per node). Please contact your sales rep for special requirements.

Super 6029BT-HNC0R, 4xNodes, 2x LGA3657, Video, 1x SIOM,3x HS NVMe/SAS3(3008),IPMI,D4(3TB),2U/R2200W

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Key Features - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 3 Hot-swap 3.5" NVMe/SAS3 drive bays; 2 M.2 SATA3 or NVMe support 5. SAS3 support via Broadcom 3008; IT mode 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2500 BMC 8. 4 Heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level (96%)

Super 6029P-E1CR12H, 2x LGA3647, Video, 2x 10GB/X557,12xHS SAS3(3108/HW Raid),IPMI,D4(2TB),2U/R1200W

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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 12 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

Super 6029P-E1CR12L, 2x LGA3647, Video, 2x 10GB/X557,12xHS SAS3(3008/IT Mode),IPMI,D4(2TB),2U/R1200W

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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 12 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3008 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

Super 6029P-E1CR12T, 2x LGA3647, Video, 2x 10GB/X557,12xHS SAS3(3108/HW Raid),IPMI,D4(2TB),2U/R1200W

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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller) 4. 12 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

Super 6029P-E1CR16T, 2x LGA3647, Video, 2x 10GB/X557,16xHS SAS3(3108/HW Raid),IPMI,D4(2TB),2U/R1600W

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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller) 4. 16 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM fans 9. 1600W Redundant Power Supplies Titanium Level (96%)

Super 6029P-E1CR24H, 2x LGA3647, Video, 2x 10GB/X557,24xHS SAS3(3108/HW Raid),IPMI,D4(2TB),2U/R1200W

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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3108 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

Super 6029P-E1CR24L, 2x LGA3647, Video, 2x 10GB/X557,24xHS SAS3(3008/IT Mode),IPMI,D4(2TB),2U/R1200W

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Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 2 & 3 occupied by controller and JBOD expansion port) 4. 24 Hot-swap 3.5" SAS3/SATA3 direct attached drive bays 5. Broadcom 3008 SAS3 AOC 6. 2x 10GBase-T LAN ports with Intel X557 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 3 Hot-swap 8cm redundant PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

Super 6029P-WTR, 2x LGA3647, 7x PCIe, Video, 2x 1GB/C621, 8x HS SAS/SATA Bays,IPMI,D4(3TB),2U/R1000W

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Key Features ¿ Web Server, Firewall Apps. ¿ Corporate-Wins, DNS, Print, Login ¿ Gateway, provisioning servers ¿ Compact Network Appliance ¿ Cloud Computing 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 4 PCI-E 3.0 x8 (FHHL) slots, 2 PCI-E 3.0 x8 (LP) slots, 1 PCI-E 3.0 x16 for Add-on-Module, 1 PCI-E M.2 SSD slot 4. 8 Hot-swap 3.5" SAS/SATA drive bays with SGPIO, 2 Fixed 3.5" drive bays 5. 1 Slim DVD-ROM drive bay (optional) 6. 2x 1GbE LAN ports via Intel C621 7. 1 VGA, 4 USB 3.0 (rear) 8. M.2 support 9. 1000W Redundant Power Supplies Titanium Level (96% Efficiency)

Super 6029P-WTRT,2x LGA3647,7x PCIe,Video,2x 10GB/C622,12x HS SAS/SATA Bays,IPMI,D4(3TB),2U/R1200W

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Key Features ¿ Web Server, Firewall Apps. ¿ Corporate-Wins, DNS, Print, Login ¿ Gateway, provisioning servers ¿ Compact Network Appliance ¿ Cloud Computing 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 1 PCI-E 3.0 x16 (FHHL) slots, 2 PCI-E 3.0 x8 (FHHL) slots, 2 PCI-E 3.0 x8 (LP) slots, 1 PCI-E 3.0 x16 for Add-on-Module, 1 PCI-E M.2 SSD slot 4. 12 Hot-swap 3.5" SAS/SATA drive bays with SES2 and Mini-i-Pass (SFF 8087) connectivity 5. 2x 10GBase-T ports via Intel C622 6. 1 VGA, 4 USB 3.0 (rear) 7. 1200W Redundant Power Supplies

Super 6029TP-HC0R, 4xNodes, 2x LGA3657, Video, 1x SIOM, 3x HS SAS3(3008)+R, IPMI, D4(2TB), 2U/R2200W

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Key Features - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 3 Hot-swap 3.5" SAS/SATA drive bays 6. Broadcom 3008 SAS3 controller; RAID 0, 1, 10 7. Mini-mSATA (half size) support 8. 2200W Redundant Power Supplies Titanium Level (96%)

Super 6029TP-HC1R, 4xNodes, 2x LGA3657, Video, 1x SIOM, 3x HS SAS3(3108)+R, IPMI, D4(2TB), 2U/R2200W

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Key Features - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 3 Hot-swap 3.5" SAS/SATA drive bays 6. Broadcom 3108 SAS3 controller; RAID 0, 1, 5, 6, 10, 50 w/ SuperCap opt. 7. Mini-mSATA (half size) support 8. 2200W Redundant Power Supplies Titanium Level (96%)

Super 6029TP-HTR, 4xNodes,2x LGA3657, Video, 1x SIOM, 3x HS SATA3(C621)+R, IPMI, D4(2TB), 2U/R2200W

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Key Features - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 3 Hot-swap 3.5" SATA3 drive bays 6. Mini-mSATA (half size) support 7. 2200W Redundant Power Supplies Titanium Level (96%)

Super 6029U-E1CR25M, 2x LGA3647,8x PCI-e,Video,2x25GB/SFP28,12x HS SAS3/Exp,IPMI,DDR4(3TB),2U/R1000W

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Key Features ¿ Virtualization ¿ Hyperconverge Storage ¿ Cloud Computing ¿ High End Enterprise Server ¿ Flexible Networking Options 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP) 4. 2 25GbE SFP28 Ethernet ports 5. 12 Hot-swap 3.5" drive bays: 12 SAS3 via opt. AOC (4 hybrid ports - opt. 4 NVMe) 6. 4 Heavy duty 8cm PWM fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU and 4 DIMM). Please contact our sales rep for special requirements.

Super 6029U-E1CR4, 2x LGA3647, 8x PCI-e, Video, 4x 1GB/i350,12x HS SAS3/Exp,IPMI,DDR4(3TB),2U/R1000W

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Key Features ¿ Virtualization ¿ Hyperconverge Storage ¿ Cloud Computing ¿ High End Enterprise Server ¿ Flexible Networking Options 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP) 4. 4 1GbE LAN ports via Intel i350 5. 12 Hot-swap 3.5" drive bays: 12 SAS3 via opt. AOC (4 hybrid ports - opt. 4 NVMe) 6. 4 Heavy duty 8cm PWM fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU and 4 DIMM). Please contact our sales rep for special requirements.

Super 6029U-E1CR4T, 2x LGA3647, 8x PCI-e,Video,4x 10GB/X710,12x HS SAS3/Exp,IPMI,DDR4(3TB),2U/R1000W

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Key Features ¿ Virtualization ¿ Hyperconverge Storage ¿ Cloud Computing ¿ High End Enterprise Server ¿ Flexible Networking Options 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 4 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP) 4. 4x 10GBase-T LAN ports via Intel X710 5. 12 Hot-swap 3.5" drive bays: 12 SAS3 via opt. AOC (4 hybrid ports - opt. 4 NVMe) 6. 4 Heavy duty 8cm PWM fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU and 4 DIMM). Please contact our sales rep for special requirements.

Super 6029U-E1CRT, 2x LGA3647, 8x PCI-e, Video,2x 10GB/X540,12x HS SAS3/Exp,IPMI,DDR4(3TB),2U/R1000W

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Key Features ¿ Virtualization ¿ Hyperconverge Storage ¿ Cloud Computing ¿ High End Enterprise Server ¿ Flexible Networking Options 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP) 4. 2x 10GBase-T LAN ports via Intel X540 5. 12 Hot-swap 3.5" drive bays: 12 SAS3 via opt. AOC (4 hybrid ports - opt. 4 NVMe) 6. 4 Heavy duty 8cm PWM fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU and 4 DIMM). Please contact our sales rep for special requirements.

Super 6029U-E1CRTP, 2x LGA3647, 8x PCI-e,Video,2x 10GB/SFP+,12x HS SAS3/Exp,IPMI,DDR4(3TB),2U/R1000W

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Key Features ¿ Virtualization ¿ Hyperconverge Storage ¿ Cloud Computing ¿ High End Enterprise Server ¿ Flexible Networking Options 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP) 4. 2 10G SFP+ Ethernet ports 5. 12 Hot-swap 3.5" drive bays: 12 SAS3 via opt. AOC (4 hybrid ports - opt. 4 NVMe) 6. 4 Heavy duty 8cm PWM fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU and 4 DIMM). Please contact our sales rep for special requirements.

Super 6029U-TR25M,2xLGA3647,8xPCI-e,Video,2x10GB/SFP28,12x HS SATA3(C621)+R,IPMI,DDR4(3TB),2U/R1000W

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Key Features ¿ Virtualization ¿ Hyperconverge Storage ¿ Cloud Computing ¿ High End Enterprise Server ¿ Flexible Networking Options 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP) 4. 2 25GbE SFP28 Ethernet ports 5. 12 Hot-swap 3.5" drive bays: 12 SATA (opt. 8 SAS3 + 4 NVMe/SAS3) 6. 4 Heavy duty 8cm fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU and 4 DIMM). Please contact our sales rep for special requirements.

Super 6029U-TR4, 2x LGA3647,8x PCI-e,Video,4x 1GB/i350,12x HS SATA3(C621)+R,IPMI,DDR4(3TB),2U/R1000W

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Key Features ¿ Virtualization ¿ Hyperconverge Storage ¿ Cloud Computing ¿ High End Enterprise Server ¿ Flexible Networking Options 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM or RDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 1 PCI-E 3.0 x16 slot (FH, 10.5" L), 5 PCI-E 3.0 x8 slots (FH, 10.5" L), 1 PCI-E 3.0 x8 slot (LP), 1 PCI-E 3.0 x8 slot (internal LP) 4. 4 1GbE LAN ports via Intel i350AM4 5. 12 Hot-swap 3.5" drive bays: 12 SATA (opt. 8 SAS3 + 4 NVMe/SAS3) 6. 4 Heavy duty 8cm fans 7. 1000W High efficiency (96%) Redundant PSU; Titanium Level. Redundant PSU; Titanium Level. SMC Note: Due to the complexity of integration, this product is sold as completely assembled systems only (with minimum 2 CPU and 4 DIMM). Please contact our sales rep for special requirements.