Super 211E-FRN2T,1xLGA-4677,4x PCIe5.0,Video,2x10GB LAN,2x Int 2.5" NVMe,M.2,IPM,D5(2TB),2U/R600W,AC
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Key Applications 5G Core and Edge AI Inference and Machine Learning Network Function Virtualization Cloud Computing Key Features Design with compliance to NEBS-Level 3 Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 2x 10GbE ports 2x 2.5" drive bays for NVMe drives Redundant 800W AC Power Supplies Ultra short depth, 2U Front I/O Edge Server
Super 211GT-HNC8F,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 350W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNC8R,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 300W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) 2 AIOM 6x NVMe/SAS/SATA drive bays
Super 211GT-HNTF,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 350W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNTR,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel® Xeon® Scalable processors up to 300W TDP Intel® C741 16 DIMM Slots up to 4TB (with Intel® Optane¿ Persistent Memory support) 2 AIOM Up to 6 Hot-swap 2.5" NVMe/SATA drives
Super 211SE-31A,3x Nodes, 4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U/F R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31AS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31D,3x Nodes,4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211SE-31DS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211TP-HPTR,4xNodes,1xLGA-4677,Video,2x10Gb/SFP+/X710,6xHS 2.5" SATA,2xM.2,IPMI,D4(2TB),2U/R2KW
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors (per node) Intel® C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 211TP-HPTRD,4xNode,1xLGA-4677,Video,2x10G/SFP+/X710,6xHS 2.5" SATA,M.2,IPMI,D4(2TB),2U/R2KW,DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel® Xeon®/4th Gen Intel® Xeon Scalable processors (per node) Intel® C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 2122TC-DL6RF4,2xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2008/IT),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 2 (x8) PCI-E 2.0 (in x16, low-profile) 4. Intel® I350 (Powerville) Quad Gigabit Ethernet LAN controller 5. 12x 2.5" Hot-swap SAS2/SATA/SSD HDDs (24 total) 6. LSI 6Gbps SAS 2008 IT Mode 7. 1280W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency) 8. IPMI 2.0 with dedicated LAN
Super 2122TC-H6RF4,4xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2108/HWR),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Quad-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency)
Super 2122TG-H6RF, 4x Nodes, 2x 6300/16C, Video,2x GB Lan,6x HS 2.5" SAS2,IPMI,D3/256G,2U,R1620W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 256GB DDR3 1866MHz ECC Registered DIMMs; 8x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platium Level Redundant Power Supplies (94% Efficiency)
Super 2122TG-H6iBQRF, 4x Nodes,2x 6300/16C,Video,2x GB Lan,6x HS 2.5" SAS2,IB,D3/256G,2U,R1620W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 256GB DDR3 1866MHz ECC Registered DIMMs; 8x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platium Level Redundant Power Supplies (94% Efficiency) 7. Mellanox ConnectX-2 QDR Infiniband 40Gbps Controller w/ QSFP connector 8. IPMI 2.0 with dedicated LAN
Super 2122TG-HTRF, 4x Nodes, 2x 6300/16C, Video,2x GB Lan,6x HS 2.5" Bays,IPMI,D3/512G,2U,R1400W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 5.9"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. 6x Hot-swap SATA Drive Bays 6. 1400W High-efficiency Redundant Power Supplies; 80PLUS Gold Certified
Super 2122TG-HiBQRF, 4x Nodes,2x 6300/16C,Video,2xGB & 1xQSFP,6x HS 2.5" SATA3,D3/512GB,2U RM,R1400W
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron¿ 6000 Series 1. Dual AMD Opteron¿ 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 5.9"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. 6x Hot-swap SATA Drive Bays 6. Mellanox ConnectX-2 QDR Infiniband 40Gbps Controller w/ QSFP connector 7. 1400W High-efficiency Redundant Power Supplies; 80PLUS Gold Certified
Super 2124GQ-NART+,2xAMD7002/3,Up to 4GPUs,2x10GB,4xHS 2.5"(SAS3/SATA/NVMe),IPMI,D4(8TB),2URM,R3000W
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Key Applications - AI Compute / Model Training / Deep Learning - High-performance Computing (HPC) Key Features 1. High Density 2U System with NVIDIA® HGX¿ A100 4-GPU 2. Supports 4 A100 40GB SXM4 GPUs 3. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink¿ 4. On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5. Dual AMD EPYC¿ 7002 Series Processors 6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8. 4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9. 2x 2200W Titanium Level power supplies with Smart Power Redundancy 2x 3000W Titanium Level Redundant Power Supply option coming soon. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, Min of 1TB Memory for 80G HGX-4 A100 OR Min of 512GB Memory for 40G HGX-4 A100, 1 Storage device, and 1 NIC included in IO board). Service: OSNBD3 is highly recommended.
Super 2124GQ-NART,2xAMD7002/3,Up to 4GPUs,2x10GB,4xHS 2.5"(SAS3/SATA/NVMe),IPMI,D4(8TB),2U RM,R2200W
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Key Applications - AI Compute / Model Training / Deep Learning - High-performance Computing (HPC) Key Features 1. High Density 2U System with NVIDIA® HGX¿ A100 4-GPU 2. Supports 4 A100 40GB SXM4 GPUs 3. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink¿ 4. On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5. Dual AMD EPYC¿ 7002 Series Processors 6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8. 4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9. 2x 2200W Titanium Level power supplies with Smart Power Redundancy 2x 3000W Titanium Level Redundant Power Supply option coming soon.
Super 2124US-TNR,2x EPYC 7003,Video,NO LAN,24x HS 2.5" U.2 NVMe/SAS/SATA,IPMI,DDR4(8TB),2U RM,R1600W
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Key Features - Virtualization - Cloud Computing - High-End Enterprise Server - Hyperconverged Storage 1. Dual AMD EPYC¿ 7003/7002 Series Processors (The latest AMD EPYC¿ 7003 Series Processor with AMD 3D V-Cache¿ Technology requires BIOS version 2.3 or newer) 2. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 3. Expansion slots: Must bundle with optional Ultra Riser Card  (see Optional Parts List) 1 PCI-E 4.0 x16 slot (FH, 9.5" L) [Details] 4. Integrated IPMI 2.0 + KVM with dedicated LAN ¿ Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5. Flexible Ultra Riser/Network options ¿ see Optional Parts List 6. Drive Bays:  24 hot-swap 2.5" U.2 NVMe drive bays  Up to 24 SATA/SAS drive support via   optional SAS kit 7. 1600W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)