Super 120C-TN10R,2x LGA-4189,4xPCIe4.0,Video,LAN via Slim-AIOM,10xHS 2.5" NVMe,IPMI,D4(6TB),1U/R860W
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Key Features Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Intel® C621A Chipset 16 DIMMs up to 6TB 3DS ECC DDR4-3200: LRDIMM/RDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 FHHL; 2 PCI-E 4.0 x16 AIOM (OCP 3.0); 2 PCI-E 3.0 x2 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 10x 2.5" hot-swap hybrid NVMe/SATA/SAS drive bays 6 counter-rotating 4 cm PWM fans with optimal fan speed control, 2 air shrouds 860W redundant Platinum level 100-240Vac and 200-240 Vdc power supplies 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (front). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with Minimum 2 CPUs, 4 DIMMs and 1 Storage Device HDD/HDS/M.2, and 1 NIC).NIC requirement can either be AIOM or PCIe card.
Super 120C-TR,2xLGA-4189,4xPCIe4.0,Video,LAN via Slim-AIOM,8xHS 2.5" SATA3 Bay,IPMI,D4(6TB),1U/R860W
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Key Features Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors Intel® C621A Chipset 16 DIMMs up to 6TB 3DS ECC DDR4-3200: LRDIMM/RDIMM/Intel® DCPMM 2 PCI-E 4.0 x16 FHHL; 2 PCI-E 4.0 x16 AIOM (OCP 3.0); 2 PCI-E 3.0 x2 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN 8x 2.5" hot-swap SATA/SAS drive bays 6 counter-rotating 4 cm PWM fans with optimal fan speed control, 2 air shrouds 860W redundant Platinum level 100-240Vac and 200-240 Vdc power supplies 1 VGA, 1 COM, 2 USB 3.0 (rear). Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with Minimum 2 CPUs, 4 DIMMs and 1 Storage Device HDD/HDS/M.2, and 1 NIC).NIC requirement can either be AIOM or PCIe card.
Super 120GQ-TNRT,2x LGA-4189,6xPCIe4.0,Video,2x10Gb,2xHS 2.5" NVMe+2x2.5" Fixed,IPMI,D4(4TB),1U/R2KW
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Key Applications - Scientific Virtualization - Rendering Key Features 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane¿ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane¿ Persistent Memory 200 series 6 PCI-E Gen 4.0 x16 (4 FHFL & 2 LP) 1 M.2 NVMe Supported 2x 2.5" NVMe Hot-swap drive bays 2x 2.5" SATA Internal Fixed drive bays 9 counter rotating fans w/ Optimal Fan Speed Control 2x 2000W redundant Titanium level power supplies
Super 120H-TNR,2xLGA-4189,3xPCIe4.0,Video,LAN via Slim-AIOM,8xHS 2.5" SAS/NVMe,IPMI,D4(8TB),1U/R12KW
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Key Applications - Virtualization - Software-defined Storage - AI Inference and Machine Learning - Cloud Computing - Enterprise Server Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane¿ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane¿ Persistent Memory 200 series 3 PCI-E 4.0 x16 slots with support for GPU/Accelerator cards Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible) 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card 8 heavy duty hot-swap fans with optimal fan speed control. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with Minimum 2 CPUs, 4 DIMMs and 1 Storage Device HDD/HDS/M.2, and 1 NIC).
Super 120TP-DC8TR,2xNode,2xLGA-4189,Video,2x10Gb/X710,4xHS 2.5" SAS3(S3808L)+R,IPMI,D4(4TB),1U/R1KW
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Key Applications High Performance Computing Hyper-Converged Infrastructure Big Data / Big Science Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors Intel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm) Intel® X710 Dual port 10GBase-T LAN onboard
Super 120TP-DC9TR,2xNode,2xLGA-4189,Video,2x10Gb/X710,4xHS 2.5" SAS3(S3908L)+R,IPMI,D4(4TB),1U/R1KW
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Key Applications - High Performance Computing - Hyper-Converged Infrastructure - Big Data / Big Science Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors Intel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 1 PCI-E 4.0 x16 (LP), 1 PCI-E 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm) Intel® X710 Dual port 10GBase-T LAN onboard 4x 2.5" hot-swap SATA/SAS drive bays 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System) Two 1000W redundant power supplies with PMBus ASPEED AST2600 BMC, 2 USB, VGA. RoT Broadcom® 3908 SAS (12Gbps); 4 slots per node; RAID 0, 1, 5, 6, 10 support.
Super 120TP-DTTR,2xNode,2xLGA-4189,Video,2x10Gb/X710,4xHS 2.5" SATA3(C621A)+R,IPMI,D4(4TB),1U/R1KW
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Key Applications High Performance Computing Hyper-Converged Infrastructure Big Data / Big Science Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors Intel® C621A chipset 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM 2 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm) Intel® X710 Dual port 10GBase-T LAN onboard 4x 2.5" hot-swap SATA drive bays
Super 120U-TNR, 2x LGA-4189,3xPCIe4.0,Video,LAN via Slim-AIOM,12xHS 2.5" SAS/NVMe,IPMI,D4(8TB),R12KW
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Key Applications - Virtualization - HPC - Cloud Computing - High End Enterprise Server - Software Defined Storage - Application Tier Service Provider - 5G/Telco Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors Intel® C621A Chipset 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane¿ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane¿ Persistent Memory 200 series 1 Internal PCI-E 4.0 x16 1 PCI-E 4.0 x16 (LP) 2 PCI-E 4.0 x16 (FH, 10.5"L) Flexible networking options 12x2.5" hot-swap hybrid NVMe/SATA/SAS drive bays 8 heavy duty fans with optimal fan speed control 1200W redundant Titanium level power supplies. Complete System Only:To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, 4 DIMMs, 1 Storage Device HDD/HDS/M.2, and 1 NIC adapter*). *NIC adapter requirement includes either 1 Ultra Riser card with integrated NIC or 1 AOC-URG4N4 Ultra Riser card with 1 standard PCI-E NIC adapter.
Super 121C-TN10R,4th Gen2xLGA-4677,4xPCIe5.0,Video,2xAIOM,10xHS 2.5" SAS3/NVMe,IPMI,D5(4TB),1U/R860W
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Key Applications Web Server, Firewall Application Data Center Optimized, Value IaaS Cloud Computing, Compact Server DNS & Gateway Servers, Firewall Application CDN, Edge Nodes Key Features Dual sockets E (LGA-4677) 4rd Gen Intel® Xeon® Scalable processors 16 DIMMs up to 4TB 3DS ECC DDR5-4800: RDIMM 2 PCIe 5.0 x16 FHHL; 2 PCIe 5.0 x16 AIOM (OCP 3.0); 2 PCIe 5.0 x4 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
Super 121C-TN2R,4th Gen2xLGA-4677,4xPCIe5.0,Video,2xAIOM,8xHS 2.5" SAS3/NVMe,IPMI,D5(4TB),1U/R860W
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Key Applications Web Server, Firewall Application Data Center Optimized, Value IaaS Cloud Computing, Compact Server DNS & Gateway Servers, Firewall Application CDN, Edge Nodes Key Features Dual sockets E (LGA-4677) 4rd Gen Intel® Xeon® Scalable processors 16 DIMMs up to 4TB 3DS ECC DDR5-4800: RDIMM 2 PCIe 5.0 x16 FHHL; 2 PCIe 5.0 x16 AIOM (OCP 3.0); 2 PCIe 5.0 x4 NVMe M.2 Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
Super 121E-NE316R,4thGen2xLGA-4677,2xPCIe5.0,Video,2xAIOM,16xE3.S HS NVMe,M.2,IPMI,D5(8TB),1U/R1600W
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Key Features Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 12TB memory capacity with 16 DIMMs of 256Gb 3DS RDIMM/RDIMM DDR5 ECC memory and 16 DIMMs of 512Gb Intel® Optane PMem 300 Series Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 16x hot-swap E3.S (7.5mm) NVMe drive bays Redundant Titanium 1600W Power Supplies
Super 121E-NES24R,4th Gen 2xLGA-4677,4xPCIe5.0,Video,2xAIOM,24xE1.S HS NVMe,M.2,IPMI,D5(8TB),1U/R2KW
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Key Applications Software-defined Storage In-Memory Computing Data Intensive HPC Private & Hybrid Cloud NVMe Over Fabrics Solution Key Features Dual Socket E (LGA-4677) 4th Generation Intel® Xeon® Scalable processors. Up to 270W TDP. Supports 32 DIMMs with 2DPC, up to 12TB memory capacity with 16 DIMMs of 256Gb 3DS RDIMM/RDIMM DDR5 ECC memory and 16 DIMMs of 512Gb Intel® Optane PMem 300 Series Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant) 24x hot-swap E1.S (9.5mm or 15mm) NVMe drive bays Redundant Titanium 2000W Power Supplies
Super 2014TP-HTR, 4x Nodes, 1x AMD 7002, Video,1xSIOM,3xHS 3.5" SATA3 Bays,IPMI,D4(2TB),2U RM,R2000W
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Key Features - Compute Intensive Applications - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single AMD EPYC¿ 7002 Series Processor 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3. 2 PCI-E 4.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. Integrated IPMI 2.0 + KVM with  dedicated LAN ¿ Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 3 Hot-swap 3.5" SATA3 drive bays M.2 Interface: 4 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110, 2260, 2242 M.2 Key: M-key 6. Video via Aspeed AST2500 BMC 7. 2000W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Super 2025HS-TNR,2xEPYC/9004,Video,Via AIOM LAN,12xHS 3.5" NVMe/SAS3/SATA3,IPMI,D4(6TB),2U RM,R1600W
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Key Features 4th Generation AMD EPYC¿ 9004 Series Processors ASPEED AST2600 24 x DIMM slots, DDR5 -4800 memory support up to 6 TB 1 AIOM/OCP NIC 3.0 Slot Configuration Options for up to 4 PCI-E 5.0 x16 Slots OR Configuration Options for up to 8 PCI-E 5.0 x8 Slots
Super 2113S-WN24RT,1x AMD 7000,Video,2x 10GB/BCM57416,24x HS 2.5" U.2 NVMe,IPMI,D4(2TB),2U RM,R1200W
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Key Features ¿ Virtualization ¿ Hyperconverged Storage ¿ Cloud Computing ¿ All Flash Storage 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)   (Full redundancy based on configuration   and application load). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with 1 CPU, minimum 4 DIMMs, at least 1 NVMe). Recommended configuration for best performance is at least 1 DIMM per channel (8 DIMM Total). Please contact your sales rep for special requirements.
Super 2113S-WTRT, 1x AMD 7000, Video, 2x 10GB Lan,16x HS 2.5" SATA3 Bays,IPMI,DDR4(2TB),2U RM,R1200W
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Key Features ¿ Backup Storage ¿ Web or Database Servers ¿ Compact Network Appliance 1. Single AMD EPYC¿ 7000-Series Processor 2. Up to 2TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot,   2 PCI-E 3.0 x8 (FH/HL) slots,   2 PCI-E 3.0 x8 (LP) slots   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 16 hot-swap 2.5" SATA3 drive bays, or   10 hot-swap 2.5" SATA3 drive bays +   optional 6 U.2 NVMe drive support with   additional cables 7. 1200W Redundant Power Supplies   Titanium Level (96%)   (Full redundancy based on configuration   and application load)
Super 2114GT-DNR,2xNodes,1xEPYC 7003,Video,1xAIOM,2x HS 2.5" U.2 NVMe Gen4,IPMI,D4(2TB),2U RM,R2600W
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Key Applications - Media/Video Streaming - AI Inference and Machine Learning - Cloud Gaming - Industrial Automation, Retail, Smart Medical Expert Systems Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single AMD EPYC¿ 7003/7002 Series Processor (The latest AMD EPYC¿ 7003 Series Processor with AMD 3D V-Cache¿ Technology requires BIOS version 2.3 or newer) 2. 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3. Up to 6 PCI-E Gen 4 x16 (4 internal, 2 external) slots, 1 PCI-E 4.0 x8 AIOM slot M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4. Integrated IPMI 2.0 + KVM with  dedicated LAN ¿ Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7. 2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Super 2114GT-DPNR,2x Nodes,Ryzen 5KWX,Video,1xAIOM,2xHS 2.5" U.2 NVMe Gen4,IPMI,D4(2TB),2U RM,R2600W
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Key Applications - Media/Video Streaming - AI Inference and Machine Learning - GPU Virtualization (VDI) - Industrial Automation, Retail, Smart Medical Expert Systems Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. AMD Ryzen¿ Threadripper¿ PRO 5000WX/3000WX Series Processor, up to 64 Cores 2. 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3. 2 PCI-E Gen 4 x16 external slots, 1 PCI-E 4.0 x8 AIOM slot (or optional x16 AIOM w/ additional parts) M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4. Integrated IPMI 2.0 + KVM with  dedicated LAN ¿ Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7. 2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Super 2115GT-HNTF,4xNodes,1xAMD 9004,Video,AIOM/OCP3.0,4xHS 2.5" NVMe Bays,IPMI,D4(3TB),2U RM,R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, AMD EPYC¿ 9004 Series Processors up to 360W TDP 12 DIMM Slots , up to 3TB DDR5 memory Flexible bays for either Storage or AIOM / OCP 3.0 slots Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE Up to 4 Hot-swap 2.5" NVMe/SATA drives
Super 2115GT-HNTR,4xNodes,1xAMD 9004,Video,2xAIOM/OCP3,6xHS 2.5" NVMe Bays,IPMI,D4(3TB),2U RM,R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, AMD EPYC¿ 9004 Series Processors up to 290W TDP 12 DIMM Slots , up to 3TB DDR5 memory 2 AIOM / OCP 3.0 slots up to 6 Hot-swap 2.5"NVMe/SATA drives